9-103765-0 TE Connectivity, 9-103765-0 Datasheet - Page 76

• Manufacturer Part Number: 9-103765-0
• Description: BOARD-BOARD CONN, HEADER, 40WAY, 1ROW
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU Mod IIr

Specifications of 9-103765-0

• Pitch (mm): 2.54mm
• Gender: HDR
• Number Of Contacts: 40POS
• Number Of Contact Rows: 1
• Mounting Style: Through Hole
• Body Orientation: Right Angle
• Contact Plating: Gold Over Nickel
• Operating Temp Range: -65C to 105C
• Termination Method: Solder
• Current Rating (max): 3/ContactA
• Contact Material: Phosphor Bronze
• Housing Material: Thermoplastic
• Housing Color: Black
• Product Height (mm): 3.51mm
• Product Length (mm): 101.19mm
• Product Depth (mm): 9.4mm
• Pitch Spacing: 2.54mm
• No. Of Rows: 1
• No. Of Contacts: 40
• Contact Termination: Right Angle Through Hole
• Rohs Compliant: Yes
• Product Type: Connector
• Mount Angle: Right Angle
• Pcb Mount Retention: Without
• Surface Mount Compatible: No
• Board Standoff: Without
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 5.84 [0.230]
• Panel Mount Retention: Without
• Termination Post Length (mm [in]): 2.29 [0.090]
• Solder Tail Contact Plating: Tin over Nickel
• Header Type: Breakaway
• Number Of Positions: 40
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Number Of Rows: 1
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• High Temperature Housing: No
• High Speed Serial Data Connector: No
• Lead Free Status / RoHS Status: Compliant

Catalog 1307819
Revised 6-04
www.tycoelectronics.com
Vertical Mount, Top Entry,
High Profile, Selectively
Loaded (with Standoffs)
Material and Finish:
Housing—Brown thermoplastic, flame
retardant
C o n t a c t s—Phosphor bronze, duplex
plated .000015 [0.00038] gold on mating
area, .000050-.000100 [0.00127-
0.00254] bright tin-lead on solder area,
with entire contact underplated .000050
[0.00127] nickel
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
AMPMODU Interconnection System
[2.54]
Receptacle Assemblies, Double-Row Board Mounted
.100
*In addition to the active positions, each receptacle has four cavities on each
Notes: 1. AMP, part no. and date code stamped on housing where size
Notes:
end that are not loaded with contacts. These empty cavities aid in aligning
the receptacle with header posts during mating.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
(40 Active)
(52 Active)
No. of
Pos.
48*
60*
2. These receptacle assemblies mate with headers of the same
permits.
size as the active positions listed above. Refer to pages 160
and 161.
[2.54]
.100*
A
B
Recommended PC Board Hole Layout
2.400 [60.96]
*
±.003 [±0.08]
3.000 [76.2]
within one connector pattern.
A
tolerances not to accumulate
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
[2.54]
.100*
Dimensions
Typ.
B
2.300 [58.42]
2.900 [73.66]
B
[2.54]
.100
[1.27]
(Standoffs)
.050
[0.51]
[8.13]
.020
.320
[6.05]
.238
[0.89±0.08]
.035±.003
Receptacle
Assembly
[0.64]
102766-1
102766-4
Part No.
.025
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
[2.54]
.100
Dia.
Post Entry
[2.92]
.115
[4.45]
.175
159
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