PEMI8CSP/RT/P NXP Semiconductors, PEMI8CSP/RT/P Datasheet - Page 8

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PEMI8CSP/RT/P

Manufacturer Part Number
PEMI8CSP/RT/P
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PEMI8CSP/RT/P

Operating Temperature Min Deg. C
-40C
Operating Temperature Max Deg. C
85C
Rad Hardened
No
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
9. Package outline
Fig 11. Package outline PEMI4CSP (WLCSP10)
Table 7.
PEMIXCSP_FAM
Product data sheet
Symbol
A
A
A
b
D
E
e
e
e
e
1
2
3
WLCSP10: wafer level chip-size package; 10 bumps (4-2-4)
1
2
European
projection
Package outline dimensions of PEMI4CSP
bump A1
index area
C
B
A
Min
0.57
0.18
0.39
0.21
1.51
1.00
-
-
-
-
1
B1
e
2
e
D
3
All information provided in this document is subject to legal disclaimers.
3
B2
4-, 6- and 8-channel passive filter network with ESD protection
Rev. 1 — 3 February 2011
Typ
0.61
0.20
0.41
0.26
1.56
1.05
0.4
0.346
0.692
0.8
b
4
1/2 e
e
1
e
E
2
Max
0.65
0.22
0.43
0.31
1.61
1.10
-
-
-
-
A
PEMIxCSP family
A
2
A
1
detail X
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
X
© NXP B.V. 2011. All rights reserved.
wlcsp10_4-2-4_po
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