HTMS8001FUG/AM,005 NXP Semiconductors, HTMS8001FUG/AM,005 Datasheet - Page 14

• Manufacturer Part Number: HTMS8001FUG/AM,005
• Description: RFID Modules & Development Tools Smart Label/Tag Ics
• Manufacturer: NXP Semiconductors

Specifications of HTMS8001FUG/AM,005

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935288709005

Product Features
pre-installed applications
ICAO 9303 fle system types
Enhanced fle system types
Memory
EEPROM [byte]
Write Endurance [cycles]
Data Retention [years]
RF Interface
Standard
Frequency [MHz]
Baudrate [kbit/s]
Anticollision
Operating Distance [cm]
Security
Unique Serial Number [byte]
DES Engine
Exception Sensors
General Product Information
Operating Temperature Range [°C]
MIFARE or DESFire implementation
(option)
Packaging
MOB4 module
MOB6 module
Sawn wafer (8” on UV irradiated FFC)
Smart eID P304G003
LDS, BAC
BAC+
4 K
100 K
20
ISO 14443 A
13.56
106/212/424
True deterministic
10
7
DES3 <40ms
V, f, T, light
-25/+85
n/a
P304G003A4
P304G003A6
P304G003UA
Smart eID P308G003
LDS, BAC
BAC+
8 K
100 K
20
ISO 14443 A
13.56
106/212/424
True deterministic
1 0
7
DES3 <40ms
V, f, T, light
-25/+85
n/a
P308G003A4
P308G003A6
P308G003UA
Smart eID Products
NXP Contactless
Smart eID P310G002
LDS, BAC
BAC+
11 K
100 K
20
ISO 14443 A
13.56
106/212/424
True deterministic
10
7 (4 for MIFARE 4K emulation)
DES3 <40ms
V, f, T, light
-25/+85
MIFARE 4K optional
P310G002A4
n/a
n/a