MEC1-130-02-S-D-NP-A Samtec Inc, MEC1-130-02-S-D-NP-A Datasheet
MEC1-130-02-S-D-NP-A
Manufacturer Part Number
MEC1-130-02-S-D-NP-A
Description
Manufacturer
Samtec Inc
Type
Card Edger
Datasheet
1.MEC1-130-02-S-D-NP-A.pdf
(1 pages)
Specifications of MEC1-130-02-S-D-NP-A
Number Of Contacts
60POS
Number Of Contact Rows
2
Body Orientation
Straight
Card Thickness (mm)
1.58mm
Contact Plating
Gold Over Nickel
Contact Material
Beryllium Copper
Termination Method
Solder
Mounting Style
Surface Mount
Product Height (mm)
9.04mm
Operating Temp Range
-55C to 125C
Pitch (mm)
1mm
Housing Material
Liquid Cryst Polymer
Housing Color
Black
Current Rating (max)
2A
Voltage Rating Max
300VAC
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MEC1-130-02-S-D-NP-A
Manufacturer:
SAMTEC
Quantity:
1
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC1
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Sn or Au over 50µ"
(1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Current Rating:
2A @ 80°C ambient
(See website for details)
Voltage Rating:
300 VAC
Insertion Depth:
(5,84mm) .230" to
(8,13mm) .320"
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (05-20)
(0,15mm) .006" max (30-70)
Note: Other Gold plating
options available.
Contact Samtec.
MINI EDGE CARD SOCKET
Note: Some sizes, styles and
options are non-standard,
non-returnable.
F-210-1
(1,00mm) .03937"
MEC1 SERIES
SPECIFICATIONS
Mates with:
(1,60mm) .062" card
MEC1
1mm MEC1
9,19mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Performance data for other stack heights and complete test data
available at www.samtec.com?MEC1 or contact sig@samtec.com
(6,99)
(8,89)
.275
.350
05, 08, 20, 30, 40, 50, 60, 70
(1,00) .03937 + (2,54) .100
APPLICATION
.03937
02
01
(No. of Positions + 2) x
(1,00)
(No. of Positions + 2)
1
x (1,00) .03937
POSITIONS
PER ROW
(0,36)
.014
Rated @ -3dB Insertion Loss
WWW.SAMTEC.COM
140
139
MEC1–140–02–L–D
5.5 GHz / 11 Gbps
6.5 GHz / 13 Gbps
(1,83)
(9,04)
.072
.356
(0,15)
.006
02
(8,51)
.335
MEC1–120–02–F–D–A
POSITIONS
PER ROW
= 10µ" (0,25µm) Gold on contact,
05
08
20
30
40
50
60
70
PLATING
(0,89)
OPTION
= Gold fl ash on contact,
.035
DIA
Matte Tin on tail
53, 54, 115 & 116
Matte tin on tail
31, 32, 63 & 64
(No Contact)
POLARIZED
OPTION
POSITIONS
–A
15, 16
21, 22
31, 32
41, 42
–F
–L
(1,00mm)
3, 4
5, 6
.03937" pitch
(1,40)
.055
MEC1–130–02–F–D–A
D
• Locking Clip (Manual
• Non-polarized
Call Samtec.
APPLICATION
placement required).
SPECIFIC
OPTION
Mates with
(1,60mm)
.062" card
Polyimide fi lm
= Tape & Reel
= Alignment
Pin metal or
OPTION
= (7,87mm)
discretion.
OTHER
Place Pad
plastic at
.310" DIA
Samtec
–TR
Pick &
–A
–K
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