74LVCH322244AEC;55 NXP Semiconductors, 74LVCH322244AEC;55 Datasheet - Page 10

• Manufacturer Part Number: 74LVCH322244AEC;55
• Description: 74LVCH322244AEC/LFBGA96/TRAYDP
• Manufacturer: NXP Semiconductors
• Series: 74LVCHr

Specifications of 74LVCH322244AEC;55

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 8
• Number Of Bits Per Element: 4
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Logic Family: LVC
• Number Of Channels Per Chip: 32
• Polarity: Non-Inverting
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 1.2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 12 mA
• Low Level Output Current: 12 mA
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 32 / 32
• Output Type: 3-State
• Propagation Delay Time: 11 ns at 1.2 V, 3 ns at 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 74LVCH322244AEC; 74LVCH322244AEC; 935263930557

Philips Semiconductors
PACKAGE OUTLINE
2004 May 25
LFBGA96: plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm
32-bit buffer/line driver; with 30
resistors; 5 V input/output tolerant; 3-state
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT536-1
max.
1.5
A
0.41
0.31
A
1
ball A1
index area
ball A1
index area
1.2
0.9
A
2
IEC
0.51
0.41
M
R
P
N
K
H
G
E
D
C
B
A
T
L
J
F
b
e
1
5.6
5.4
D
2
3
1/2
e 1
D
13.6
13.4
4
e
E
5
b
JEDEC
6
0.8
e
0
REFERENCES
1/2
B
e
e
e
4
1
w
v
e 2
A
E
series termination
M
M
12
e
C
C
2
JEITA
scale
10
A
5
0.15
B
v
0.1
w
A
A
10 mm
2
0.1
y
y 1 C
A
1
0.2
y
1
detail X
PROJECTION
EUROPEAN
X
C
y
74LVCH322244A
Product specification
ISSUE DATE
00-03-04
03-02-05
SOT536-1