ADA4417-3ARMZ-R7 Analog Devices Inc, ADA4417-3ARMZ-R7 Datasheet - Page 5

• Manufacturer Part Number: ADA4417-3ARMZ-R7
• Description: IC,TV/VIDEO CIRCUIT,TV/Video Filter,TSSOP,10PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Type: Video Filterr

Specifications of ADA4417-3ARMZ-R7

• Applications: Set-Top Boxes, Video Players
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
10-Lead MSOP
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4417-3
package is limited by the associated rise in junction temperature
(T
transition temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit can change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the ADA4417-3. Exceeding a
junction temperature of 175°C for an extended period can
result in changes in the silicon devices potentially causing
failure.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
JA
J
) on the die. At approximately 150°C, which is the glass
is specified for the worst-case conditions, that is, a device
θ
130
JA
5.5 V
Rating
See Figure 2
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Unit
°C/W
Rev. A | Page 5 of 16
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the supply voltage (V
Assuming the load (R
some of which is dissipated in the package and some in the load
(V
RMS output voltages should be considered. If R
GND, the total power is V
Airflow increases heat dissipation, effectively reducing θ
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduce the θ
Figure 2 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 10-lead MSOP
(130°C/W) on a JEDEC standard 4-layer board. θ
approximate.
Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
OUT
V
× I
S
/2 × I
2.0
1.5
1.0
0.5
OUT
0
–40 –30 –20 –10
).
JA
OUT
.
L
) is midsupply, then the total drive power is
AMBIENT TEMPERATURE (°C)
0
S
× I
10
S
OUT
) times the quiescent current (I
20
.
30
D
40
) is the sum of the
50
ADA4417-3
L
60
is referenced to
JA
values are
70
80
JA
. In
S
).