ADUM5402ARWZ-RL Analog Devices Inc, ADUM5402ARWZ-RL Datasheet - Page 2

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ADUM5402ARWZ-RL

Manufacturer Part Number
ADUM5402ARWZ-RL
Description
IC,Digital Coupler,SOP,16PIN,PLASTIC
Manufacturer
Analog Devices Inc
Series
IsoPower®, iCoupler®r
Datasheet

Specifications of ADUM5402ARWZ-RL

Inputs - Side 1/side 2
2/2
Number Of Channels
4
Isolation Rating
2500Vrms
Voltage - Supply
3.3V, 5V
Data Rate
1Mbps
Propagation Delay
55ns
Output Type
Logic
Package / Case
16-SOIC (0.300", 7.5mm Width)
Operating Temperature
-40°C ~ 105°C
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
105C
Package Type
SOIC W
Rad Hardened
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
EVAL-ADUM540XEBZ - BOARD EVAL FOR ADUM540x
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADUM5402ARWZ-RL
Manufacturer:
AD
Quantity:
2 100
Part Number:
ADUM5402ARWZ-RL
Manufacturer:
AD
Quantity:
1 200
Part Number:
ADUM5402ARWZ-RL
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ADuM5401/ADuM5402/ADuM5403/ADuM5404
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams ............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 9
REVISION HISTORY
11/08—Rev. 0 to Rev. A
Changes to Figure 1 and General Description Section ............... 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 5
Changes to Table 4 ............................................................................ 7
Changes to Table 6 and Table 7 ....................................................... 8
Changes to Table 8 and Table 9 ....................................................... 9
Changes to Figure 7 and Table 10 ................................................. 10
Changes to Figure 8 and Table 11 ................................................. 11
Changes to Figure 9 and Table 12 ................................................. 12
Changes to Figure 10 and Table 13 ............................................... 13
Moved Truth Table Section ........................................................... 13
Changes to Applications Information Section and PCB Layout
Section .............................................................................................. 17
Changes to DC Correctness and Magnetic Field Immunity
Section .............................................................................................. 18
Changes to Power Considerations Section ................................. 20
Added Increasing Available Power Section, Table 15, and
Table 16 ............................................................................................ 20
Electrical Characteristics—5 V Primary Input Supply/
5 V Secondary Isolated Supply ................................................... 3
Electrical Characteristics—3.3 V Primary Input Supply/
3.3 V Secondary Isolated Supply ................................................ 5
Package Characteristics ............................................................... 7
Regulatory Approvals ................................................................... 7
Insulation and Safety-Related Specifications ............................ 7
DIN V VDE V 0884-10 (VDE V 0884-10) Insulation
Characteristics .............................................................................. 8
Recommended Operating Conditions ...................................... 8
ESD Caution .................................................................................. 9
Rev. A | Page 2 of 24
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
Pin Configurations and Function Descriptions ......................... 10
Typical Performance Characteristics ........................................... 14
Terminology .................................................................................... 16
Applications Information .............................................................. 17
Outline Dimensions ....................................................................... 22
5/08—Revision 0: Initial Version
Truth Table .................................................................................. 13
PCB Layout ................................................................................. 17
Thermal Analysis ....................................................................... 18
EMI Considerations ................................................................... 18
Propagation Delay-Related Parameters ................................... 18
DC Correctness and Magnetic Field Immunity ........................... 18
Power Consumption .................................................................. 19
Power Considerations ................................................................ 20
Increasing Available Power ....................................................... 20
Insulation Lifetime ..................................................................... 21
Ordering Guide .......................................................................... 22
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

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