CY7C1370D-200AXC Cypress Semiconductor Corp, CY7C1370D-200AXC Datasheet - Page 20

• Manufacturer Part Number: CY7C1370D-200AXC
• Description: IC,SYNC SRAM,512KX36,CMOS,QFP,100PIN,PLASTIC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1370D-200AXC

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 18M (512K x 36)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Density: 18Mb
• Access Time (max): 3ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 200MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 19b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 4
• Supply Current: 300mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 36b
• Number Of Words: 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-2137; CY7C1370D-200AXC

Electrical Characteristics
Over the Operating Range (continued)
Capacitance
Thermal Resistance
Note
Document Number: 38-05555 Rev. *K
I
I
I
C
C
C
18. Tested initially and after any design or process change that may affect these parameters.
SB2
SB3
SB4
Parameter
Parameter
IN
CLK
I/O
Parameter
OUTPUT
OUTPUT
3.3V I/O Test Load
2.5V I/O Test Load


JA
JC
Automatic CE
Power-down
Current—CMOS Inputs
Automatic CE
Power-down
Current—CMOS Inputs
Automatic CE
Power-down
Current—TTL Inputs
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Z
Z
[18]
0
0
= 50
= 50
Description
Description
Description
(a)
(a)
V
V
T
T
= 1.25V
[18]
= 1.5V
R
R
L
L
= 50
= 50
[16, 17]
Max. V
 0.3V or V
Max. V
 0.3V or V
f
Max. V
 V
OUTPUT
OUTPUT
MAX
3.3V
2.5V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
IH
Figure 4. AC Test Loads and Waveforms
= 1/t
or V
INCLUDING
INCLUDING
DD
DD
DD
T
JIG AND
JIG AND
, Device Deselected, V
, Device Deselected, V
CYC
, Device Deselected, V
A
IN
Test Conditions
SCOPE
SCOPE
Test Conditions
IN
IN
= 25C, f = 1 MHz,
5 pF
5 pF
 V
V
> V
> V
V
DDQ
DD
IL
DDQ
DDQ
, f = 0
= 3.3V.
= 2.5V
Test Conditions
(b)
(b)
0.3V, f = 0
0.3V, f =
R = 317
R = 1667
R = 351
R = 1538
IN
IN
IN
All speed grades
4-ns cycle, 250 MHz
5-ns cycle, 200 MHz
6-ns cycle, 167 MHz
All speed grades
100 TQFP
100 TQFP
Package
V
28.66
Max
4.08
GND
GND
DDQ
V
5
5
5
DDQ
 1 ns
 1 ns
10%
10%
CY7C1370D, CY7C1372D
119 BGA
Package
119 BGA
23.8
Max
ALL INPUT PULSES
ALL INPUT PULSES
6.2
8
8
8
90%
90%
Min.
(c)
(c)
165 FBGA
Package
165 FBGA
20.7
4.0
Max
9
9
9
Max.
135
130
125
70
80
90%
90%
10%
10%
Page 20 of 29
C/W
C/W
 1 ns
 1 ns
Unit
Unit
Unit
pF
pF
pF
mA
mA
mA
mA
mA
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