STTH1R02 STMicroelectronics, STTH1R02 Datasheet - Page 5

• Manufacturer Part Number: STTH1R02
• Description: DIODE FAST 200V 1.5A DO-41
• Manufacturer: STMicroelectronics

Specifications of STTH1R02

• Voltage - Forward (vf) (max) @ If: 1V @ 1.5A
• Voltage - Dc Reverse (vr) (max): 200V
• Current - Average Rectified (io): 1.5A
• Current - Reverse Leakage @ Vr: 3µA @ 200V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 30ns
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO-41, Axial
• Product: Ultra Fast Recovery Rectifier
• Configuration: Single
• Reverse Voltage: 200 V
• Forward Voltage Drop: 1.2 V at 4.5 A
• Recovery Time: 30 ns
• Forward Continuous Current: 1.5 A
• Max Surge Current: 60 A
• Reverse Current Ir: 3 uA
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 175 C
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-5571-3

STTH1R02
Figure 11. Peak reverse recovery curent
Figure 13. Thermal resistance, junction to
Figure 15. Thermal resistance, junction to
120
100
8
7
6
5
4
3
2
1
0
100
80
60
40
20
10
90
80
70
60
50
40
30
20
10
0
0
0.0
0
V
I
F
R
=1.5A
=160V
0.5
versus dI
ambient, versus copper surface
under each lead - SMA (Epoxy FR4,
copper thickness = 35 µm)
ambient, versus copper surface
under each lead - DO 15 (Epoxy
FR4, copper thickness = 35 µm)
1.0
1
1.5
2.0
2
F
/dt (typical values)
T
100
j
=125°C
2.5
3.0
3
T
j
3.5
=25°C
4.0
4
dI
F
S
/dt(A/µs)
S
CU
CU
(cm²)
(cm²)
4.5
DO-15
SMA
1000
5.0
5
Figure 12. Dynamic parameters versus
Figure 14. Thermal resistance, junction to
Figure 16. Thermal resistance, junction to
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
110
100
100
90
80
70
60
50
40
30
20
10
90
80
70
60
50
40
30
20
10
0
0
25
0.0
0
V
I
F
R
=1.5A
=160V
0.5
1
junction temperature
ambient, versus copper surface
under each lead - SMB (Epoxy FR4,
copper thickness = 35 µm)
ambient, versus copper surface
under each lead - DO-41 (Epoxy
FR4, copper thickness = 35 µm)
50
1.0
2
I
RM
1.5
3
Q
RR
75
2.0
4
S
S(cm²)
CU
2.5
(cm²)
5
100
3.0
6
3.5
7
Characteristics
125
4.0
8
T
j
(°C)
DO-41
4.5
9
SMB
150
5.0
10
5/10