BAS16T,115 NXP Semiconductors, BAS16T,115 Datasheet - Page 17

• Manufacturer Part Number: BAS16T,115
• Description: DIODE SW 85V 155MA H-S SC-75
• Manufacturer: NXP Semiconductors

Specifications of BAS16T,115

• Package / Case: EMT3 (SOT-416, SC-75-3)
• Mounting Type: Surface Mount
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Voltage - Dc Reverse (vr) (max): 100V
• Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
• Current - Average Rectified (io): 155mA (DC)
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.155 A
• Max Surge Current: 4 A
• Configuration: Single
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 1 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934054831115::BAS16T T/R::BAS16T T/R

NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 29. Wave soldering footprint BAS316 (SOD323/SC-76)
Fig 30. Reflow soldering footprint BAS516 (SOD523/SC-79)
2.75
1.2
(2 )
Reflow soldering is the only recommended soldering method.
1.2
(2 )
(2 )
0.7
0.8
1.5 (2 )
Rev. 05 — 25 August 2008
2.15
1.1
2.9
5
(2 )
0.5
(2 )
0.6
High-speed switching diodes
BAS16 series
Dimensions in mm
direction during soldering
Dimensions in mm
preferred transport
solder lands
solder resist
solder paste
occupied area
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
occupied area
sod523_fr
sod323_fw
17 of 20