IRF7907PBF International Rectifier, IRF7907PBF Datasheet - Page 7

MOSFET N-CHAN DUAL 30V 8-SOIC

IRF7907PBF

Manufacturer Part Number
IRF7907PBF
Description
MOSFET N-CHAN DUAL 30V 8-SOIC
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheets

Specifications of IRF7907PBF

Fet Type
2 N-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
16.4 mOhm @ 9.1A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
9.1A, 11A
Vgs(th) (max) @ Id
2.35V @ 25µA
Gate Charge (qg) @ Vgs
10nC @ 4.5V
Input Capacitance (ciss) @ Vds
850pF @ 15V
Power - Max
2W
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Channel Type
Dual N
Current, Drain
9.1/11 Q1/Q2 A
Gate Charge, Total
6.7 nC (Control FET), 14 nC (Synchronous FET)
Package Type
SO-8
Polarization
N-Channel
Power Dissipation
2/2 Q1/Q2 W
Resistance, Drain To Source On
0.0164/0.0118 Q1/Q2 Ohm
Resistance, Thermal, Junction To Case
90/62.5 Q1/Q2 DegC/W
Temperature, Operating, Maximum
+150 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
8 ns (Control FET), 13 ns (Synchronous FET)
Time, Turn-on Delay
6 ns (Control FET), 8 ns (Synchronous FET)
Transconductance, Forward
19 S (Control FET), 24 S (Synchronous FET)
Voltage, Breakdown, Drain To Source
30 V
Voltage, Forward, Diode
1 V
Voltage, Gate To Source
±20 V
Configuration
Dual
Transistor Polarity
Dual N-Channel
Resistance Drain-source Rds (on)
20.5 mOhms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
9.1 A
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Fall Time
3.4 ns, 5.3 ns
Gate Charge Qg
6.7 nC
Minimum Operating Temperature
- 55 C
Rise Time
9.3 ns, 14 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF7907PBF
Manufacturer:
IR
Quantity:
20 000
www.irf.com
0.01
0.01
100
100
0.1
0.1
10
10
1
1E-006
1
1E-006
Fig 26. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient (Q2)
Fig 25. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient (Q1)
D = 0.50
D = 0.50
0.20
0.10
0.05
0.02
0.01
0.20
0.10
0.05
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
0.0001
V
C
o
o
t 1 , Rectangular Pulse Duration (sec)
t 1 , Rectangular Pulse Duration (sec)
L
0.001
0.001
Fig 27. Layout Diagram
0.01
0.01
τ
J
τ
τ
J
J
τ
τ
GND
1
J
Ci= τi/Ri
τ
τ
1
Ci= τi/Ri
1
τ
S2
G2
S1
G1
Ci i/Ri
1
Ci
R
i/Ri
2
3
4
R
1
1
R
1
R
1
1
0.1
τ
0.1
2
τ
R
τ
2
2
R
τ
2
R
2
2
R
2
2
R
τ
3
R
τ
3
R
τ
3
3
7
6
5
R
8
C
3
3
τ
V
3
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Ta
3
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Ta
in
in
D2
D2
D1
D1
τ
R
4
τ
τ
1
R
4
4
1
R
4
τ
4
R
4
4
4
τ
a
τ
a
Ri (°C/W)
2.288789 0.000137
7.167906 0.014957
36.98193
16.07333
Ri (°C/W)
1.848416 0.000164
11.29818 0.054158
34.97452
14.3858
10
10
τι (sec)
0.72461
τι (sec)
0.9598
26.8
38.2
100
100
7

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