BAP142LX,315 NXP Semiconductors, BAP142LX,315 Datasheet

DIODE SILICON PIN SOD-882T

BAP142LX,315

Manufacturer Part Number
BAP142LX,315
Description
DIODE SILICON PIN SOD-882T
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP142LX,315

Package / Case
SOD-882
Diode Type
PIN - Single
Voltage - Peak Reverse (max)
50V
Current - Max
100mA
Capacitance @ Vr, F
0.26pF @ 20V, 1MHz
Resistance @ If, F
1.3 Ohm @ 100mA, 100MHz
Power Dissipation (max)
130mW
Configuration
Single
Reverse Voltage
50 V
Forward Continuous Current
100 mA
Frequency Range
UHF or SHF
Forward Voltage Drop
1.1 V
Maximum Diode Capacitance
0.26 pF @ 20 V
Maximum Operating Temperature
+ 150 C
Maximum Series Resistance @ Maximum If
1.3 Ohm @ 100 mA
Maximum Series Resistance @ Minimum If
5 Ohm @ 0.5 mA
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Power Dissipation
130 mW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934061244315
BAP142LX T/R
BAP142LX T/R
1. Product profile
2. Pinning information
3. Ordering information
1.1 General description
1.2 Features
1.3 Applications
Planar PIN diode in a SOD882T leadless ultra small plastic SMD package.
I
I
I
I
I
I
Table 1.
[1]
Table 2.
Pin
1
2
Type number Package
BAP142LX
BAP142LX
Silicon PIN diode
Rev. 01 — 30 July 2007
High voltage, current controlled RF resistor
Low diode capacitance
Low losses at very low currents
Very low series inductance
For applications up to 3 GHz
RF attenuators and switches
The marking bar indicates the cathode.
Discrete pinning
Ordering information
Description
cathode
anode
Name
-
Description
leadless ultra small plastic package; 2 terminals;
body 1
0.6
0.4 mm
[1]
Simplified outline
Transparent
1
top view
2
Product data sheet
Symbol
sym006
Version
SOD882T

Related parts for BAP142LX,315

BAP142LX,315 Summary of contents

Page 1

BAP142LX Silicon PIN diode Rev. 01 — 30 July 2007 1. Product profile 1.1 General description Planar PIN diode in a SOD882T leadless ultra small plastic SMD package. 1.2 Features I High voltage, current controlled RF resistor I Low diode ...

Page 2

... NXP Semiconductors 4. Marking Table 3. Type number BAP142LX 5. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot T stg Thermal characteristics Table 5. Symbol R th(j-sp) 7. Characteristics Table 6. Characteristics unless otherwise specified. amb Symbol Parameter V forward voltage F I reverse current ...

Page 3

... NXP Semiconductors Table 6. Characteristics …continued unless otherwise specified. amb Symbol Parameter ISL isolation L insertion loss ins L insertion loss ins L insertion loss ins L insertion loss ins charge carrier life time L L series inductance S BAP142LX_1 Product data sheet Conditions see Figure 900 MHz ...

Page 4

... NXP Semiconductors 400 C d (fF) 300 200 100 MHz Fig 1. Diode capacitance as a function of reverse voltage; typical values 0 ISL (dB 1000 amb Diode zero biased and inserted in series with a 50 stripline circuit Fig 3. Isolation of the diode as a function of frequency; typical values BAP142LX_1 Product data sheet ...

Page 5

... NXP Semiconductors 8. Package outline Leadless ultra small plastic package; 2 terminals; body 1 x 0 (1) DIMENSIONS (mm are the original dimensions UNIT max 0.40 0.55 0.65 mm 0.04 0.36 0.45 0.55 Note 1. The marking bar indicates the cathode OUTLINE VERSION IEC SOD882T Fig 5. Package outline SOD882T ...

Page 6

... NXP Semiconductors 9. Abbreviations Table 7. Acronym PIN SMD RF 10. Revision history Table 8. Revision history Document ID Release date BAP142LX_1 20070730 BAP142LX_1 Product data sheet Abbreviations Description P-type, Intrinsic, N-type Surface Mounted Device Radio Frequency Data sheet status Product data sheet Rev. 01 — 30 July 2007 ...

Page 7

... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

Page 8

... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Legal information 11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7 11.2 Defi ...

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