AD7533KN Analog Devices Inc, AD7533KN Datasheet - Page 12

• Manufacturer Part Number: AD7533KN
• Description: DAC 1-CH R-2R 10-Bit 16-Pin PDIP
• Manufacturer: Analog Devices Inc

Specifications of AD7533KN

• Package: 16PDIP
• Resolution: 10 Bit
• Conversion Rate: 1.7 MSPS
• Architecture: R-2R
• Digital Interface Type: Parallel
• Number Of Outputs Per Chip: 1
• Output Type: Current
• Full Scale Error: ±1 %FSR
• Integral Nonlinearity Error: ±0.1 %FSR
• Maximum Settling Time: 0.8 us
• Rohs Status: RoHS non-compliant
• Settling Time: 600ns
• Number Of Bits: 10
• Data Interface: Parallel
• Number Of Converters: 1
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 30mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)

AD7533
ORDERING GUIDE
Model
AD7533ACHIPS
AD7533JN
AD7533JNZ
AD7533KN
AD7533KNZ
AD7533LN
AD7533LNZ
AD7533JP
AD7533JP-REEL
AD7533JPZ
AD7533JPZ-REEL
AD7533KP
AD7533KP-REEL
AD7533KPZ
AD7533KPZ-REEL
AD7533KR
AD7533KR-REEL
AD7533KRZ
AD7533KRZ-REEL
AD7533AQ
AD7533BQ
AD7533CQ
AD7533SQ
AD7533UQ
AD7533UQ/883B
AD7533TE/883B
1
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS compliant part.
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
C01134-0-3/07(C)
Package Description
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
20-Lead Plastic Leaded Chip Carrier [PLCC]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Standard Small Outline Package [SOIC_W]
16-Lead Ceramic Dual In-Line Package [CERDIP]
16-Lead Ceramic Dual In-Line Package [CERDIP]
16-Lead Ceramic Dual In-Line Package [CERDIP]
16-Lead Ceramic Dual In-Line Package [CERDIP]
16-Lead Ceramic Dual In-Line Package [CERDIP]
16-Lead Ceramic Dual In-Line Package [CERDIP]
20-Terminal Ceramic Leadless Chip Carrier [LCC]
T
Rev. C | Page 12 of 12
Package Option
DIE
N-16
N-16
N-16
N-16
N-16
N-16
P-20
P-20
P-20
P-20
P-20
P-20
P-20
P-20
RW-16
RW-16
RW-16
RW-16
Q-16
Q-16
Q-16
Q-16
Q-16
Q-16
E-20-1
Nonlinearity
(% FSR max)
±0.2
±0.2
±0.1
±0.1
±0.05
±0.05
±0.2
±0.2
±0.2
±0.2
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.2
±0.1
±0.05
±0.2
±0.05
±0.05
±0.1
T T T