HSMP-3862-BLKG Avago Technologies US Inc., HSMP-3862-BLKG Datasheet

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HSMP-3862-BLKG

Manufacturer Part Number
HSMP-3862-BLKG
Description
DIODE PIN GP 50V LOW COST SOT-23
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HSMP-3862-BLKG

Diode Type
PIN - 1 Pair Series Connection
Voltage - Peak Reverse (max)
50V
Current - Max
1A
Capacitance @ Vr, F
0.2pF @ 50V, 1MHz
Resistance @ If, F
1.5 Ohm @ 100mA, 100MHz
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Diode Case Style
SOT-23
Series Resistance @ If
1.5ohm
Peak Reflow Compatible (260 C)
Yes
Capacitance Ct
0.2pF
Current Rating
1A
Leaded Process Compatible
Yes
Breakdown Voltage
50V
Capacitance
0.20pF
Mounting Type
Surface Mount
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HSMP-3862-BLKG
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HSMP-3862-BLKG
Manufacturer:
AVAGO/安华高
Quantity:
20 000
HSMP-386x
Surface Mount PIN Diodes
Data Sheet
Description/Applications
The HSMP-386x series of general purpose PIN diodes are
designed for two classes of applications. The first is attenu-
ators where current consumption is the most important
design consideration. The second application for this
series of diodes is in switches where low capacitance is the
driving issue for the designer.
The HSMP-386x series Total Capacitance (C
sistance (R
require guaranteed performance, the general purpose HSMP-
383x series is recommended.
A SPICE model is not available for PIN diodes as SPICE
does not provide for a key PIN diode characteristic, carrier
lifetime.
Pin Connections and Package Marking, SOT-363
Notes:
1. Package marking provides orientation, identification, and date code.
2. See “Electrical Specifications” for appropriate package marking.
1
2
3
T
) are typical specifications. For applications that
6
5
4
T
) and Total Re-
Features
• Unique Configurations in Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
• Switching
– Low Distortion Switching
– Low Capacitance
• Attenuating
– Low Current Attenuating for Less Power
• Matched Diodes for Consistent Performance
• Better Thermal Conductivity for Higher Power
• Low Failure in Time (FIT) Rate
• Lead-free
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.
Dissipation
Consumption
[1]

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HSMP-3862-BLKG Summary of contents

Page 1

... The HSMP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenu- ators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. The HSMP-386x series Total Capacitance (C sistance (R ) are typical specifications. For applications that T require guaranteed performance, the general purpose HSMP- 383x series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime ...

Page 2

... T Junction Temperature j T Storage Temperature stg q Thermal Resistance [2] jc Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device +25°C, where T is defined to be the temperature at the package pins where contact is made the circuit board. Electrical Specifications T = 25°C, each diode C PIN General Purpose Diodes, Typical Specifications T Package Part Number Marking HSMP- Code 3860 L0 3862 L2 3863 L3 3864 L4 386B L0 386C L2 386E L3 386F L4 386L LL T est Conditions ...

Page 3

... MHz 0.20 1 GHz 0. REVERSE VOLTAGE (V) Figure 1. RF Capacitance vs. Reverse Bias. 1000 100 FORWARD CURRENT (mA) Figure 4. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. Equivalent Circuit Model HSMP-386x Chip 1.5 Ω 0. 25°C C Carrier Lifetime Reverse Recovery Time t (ns) 500 250 mA R 1000 – 100 ...

Page 4

Typical Applications for Multiple Diode Products RF COMMON RF 1 BIAS 1 Figure 6. Simple SPDT Switch, Using Only Positive Current. RF COMMON RF 1 Figure 8. Switch Using Both Positive and Negative Current. VARIABLE BIAS INPUT FIXED BIAS VOLTAGE Figure 10. Four Diode p Attenuator. See AN1048 for details. Figure 10. Four Diode π Attenuator. See AN1048 for details BIAS 2 BIAS Figure 7. High Isolation SPDT Switch, Dual Bias. BIAS ...

Page 5

... Typical Applications for Multiple Diode Products BIAS Figure 11. High Isolation SPST Switch Figure 11. High Isolation SPST Switch (Repeat Cells as Required). (Repeat Cells as Required Figure 13. HSMP-386L used in a SP3T Switch. 5 (continued Figure 12. HSMP-386L Unconnected Trio used in a Positive Voltage, High Isolation Switch Figure 14. HSMP-386L Unconnected Trio used in a Dual Voltage, High Isolation Switch “ON” “OFF” out “ON” “OFF” 0 – out ...

Page 6

... Ordering Information Specify part number followed by option. For example: HSMP - 386x - XXX Option Descriptions -BLKG = Bulk, 100 pcs. per antistatic bag -TR1G = Tape and Reel, 3000 devices per 7" reel -TR2G = Tape and Reel, 10,000 devices per 13" reel Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement. ” Assembly Information SOT-323 PCB Footprint Recommended PCB pad layouts for the miniature SOT packages are shown in Figures 15, 16, 17. These layouts ...

Page 7

SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity ...

Page 8

Package Dimensions Outline 23 (SOT-23 XXX SYMBOL Notes: e2 XXX-package marking E Drawings are not to scale L Outline 363 (SC-70, 6 Lead SYMBOL E D ...

Page 9

Device Orientation REEL CARRIER TAPE USER FEED DIRECTION COVER TAPE For Outlines SOT-23, -323 TOP VIEW ABC ABC ABC ABC Note: "AB" represents package marking code. "C" represents date code. Tape Dimensions and Product Orientation For Outline SOT- MAX ...

Page 10

Tape Dimensions and Product Orientation For Outlines SOT-323, -363 DESCRIPTION SYMBOL CAVITY LENGTH A 0 WIDTH B 0 DEPTH K 0 PITCH P BOTTOM HOLE DIAMETER D 1 PERFORATION DIAMETER D PITCH P 0 POSITION E CARRIER TAPE WIDTH ...

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