HSMP-3863-TR1G Avago Technologies US Inc., HSMP-3863-TR1G Datasheet - Page 7

• Manufacturer Part Number: HSMP-3863-TR1G
• Description: DIODE PIN GP 50V LOW COST SOT-23
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMP-3863-TR1G

• Diode Type: PIN - 1 Pair Common Anode
• Voltage - Peak Reverse (max): 50V
• Current - Max: 1A
• Capacitance @ Vr, F: 0.2pF @ 50V, 1MHz
• Resistance @ If, F: 1.5 Ohm @ 100mA, 100MHz
• Package / Case: SC-70-6, SC-88, SOT-363
• Diode Case Style: SOT-23
• Series Resistance @ If: 1.5ohm
• Peak Reflow Compatible (260 C): Yes
• Capacitance Ct: 0.2pF
• Polarization: Common Anode
• Leaded Process Compatible: Yes
• Breakdown Voltage: 50V
• Forward Current If: 1A
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

SMT Assembly
Reliable assembly of surface mount components is a
complex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the SOT
package, will reach solder reflow temperatures faster than
those with a greater mass.
Avago’s diodes have been qualified to the time-tempera-
ture profile shown in Figure 18. This profile is representative
of an IR reflow type of surface mount assembly process.
After ramping up from room temperature, the circuit board
with components attached to it (held in place with solder
paste) passes through one or more preheat zones. The
Figure 18. Surface Mount Assembly Profile.
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Note 1: All temperatures refer to topside of the package, measured on the package body surface
7
Reflow Parameter
Average ramp-up rate (Liquidus Temperature (T
Preheat
Ts(max) to TL Ramp-up Rate
Time maintained above:
Peak Temperature (T
Time within 5 °C of actual Peak temperature (t
Ramp-down Rate
Time 25 °C to Peak Temperature
Tp
T
25
L
Ts
Ts
min
max
P
)
t 25
Preheat
°
ts
C to Peak
Temperature Min (T
Temperature Max (T
Time (min to max) (t
Temperature (T
Time (t
P
L
)
)
Ramp-up
S(max)
Time
to Peak)
L
)
S(min)
S(max)
S
)
Ramp-down
tp
)
)
preheat zones increase the temperature of the board and
components to prevent thermal shock and begin evaporat-
ing solvents from the solder paste. The reflow zone briefly
elevates the temperature sufficiently to produce a reflow
of the solder.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not cause
deformation of the board or damage to components due
to thermal shock. The maximum temperature in the reflow
zone (T
These parameters are typical for a surface mount assembly
process for Avago diodes. As a general guideline, the circuit
board and components should be exposed only to the
minimum temperatures and times necessary to achieve a
uniform reflow of solder.
t
L
Lead-Free Assembly
3°C/ second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
260 +0/-5°C
20-40 seconds
6°C/second max
8 minutes max
MAX
) should not exceed 260°C.
Critical Zone
T
L
to Tp