MT48LC32M16A2P-75:C Micron Technology Inc, MT48LC32M16A2P-75:C Datasheet - Page 43

• Manufacturer Part Number: MT48LC32M16A2P-75:C
• Description: DRAM Chip SDRAM 512M-Bit 32Mx16 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr
• Series: -r

Specifications of MT48LC32M16A2P-75:C

• Density: 512 Mb
• Maximum Clock Rate: 133 MHz
• Package: 54TSOP-II
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: 0 to 70 °C
• Organization: 32Mx16
• Address Bus: 15b
• Access Time (max): 6/5.4ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 115mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 54-TSOP (0.400", 10.16mm Width)
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table 11:
Table 12:
Figure 32:
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
Parameter
Operating case temperature:
Commercial
Junction temperature:
Commercial
Industrial
Ambient temperature:
Commercial
Industrial
Peak reflow temperature
Industrial
Die Size
(mm
94
2
)
Temperature Limits
Summary of Thermal Impedance
Package
Example Temperature Test Point Location, 54-Pin TSOP: Top View
TSOP
Notes:
Number of
1. MAX operating case temperature, T
2. Device functionality is not guaranteed if the device exceeds maximum T
3. Both temperature specifications must be satisfied.
4. The case temperature should be measured by gluing a thermocouple to the top center of
5. Operating ambient temperature surrounding the package.
Test point
Leads
54
side of the device, as shown on page 47.
the component. This should be done with a 1mm bead of conductive epoxy, as defined by
the JEDEC EIA/JESD51 standards. Care should be taken to ensure the thermocouple bead is
touching the case.
2-layer
4-layer
Board
Test
11.11mm
43
(°C/W)
0m/s
62.6
39.2
θ
JA
22.22mm
Symbol
C
, is measured in the center of the package on the top
T
PEAK
T
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T
T
A
C
J
(°C/W)
θ
1m/s
48.4
32.3
JMA
Min
–40
–40
–40
0
0
0
–
512Mb: x4, x8, x16 SDRAM
(°C/W)
θ
2m/s
Electrical Specifications
44.2
30.6
JMA
Max
260
80
90
85
95
70
85
©2000 Micron Technology, Inc. All rights reserved.
5.08mm
(°C/W)
19.2
19.3
θ
Units
C
JB
°C
°C
°C
°C
during operation.
10.16mm
1, 2, 3, 4
(°C/W)
Notes
θ
6.7
3, 5
JC
3