SI8236AA-C-IM Silicon Laboratories Inc, SI8236AA-C-IM Datasheet - Page 46

• Manufacturer Part Number: SI8236AA-C-IM
• Description: MOSFET DRVR 4A 2-OUT Half Brdg Non-Inv 14-Pin LGA
• Manufacturer: Silicon Laboratories Inc

Specifications of SI8236AA-C-IM

• Package: 14LGA
• Driver Configuration: Non-Inverting
• Peak Output Current: 4 A
• Input Logic Compatibility: TTL
• Number Of Outputs: 2
• Output Resistance: 2.7 Ohm
• Maximum Rise Time: 20 ns
• Maximum Power Dissipation: 1200 mW
• Maximum Supply Current: 2.5(Typ) mA
• Operating Temperature: -40 to 125 °C
• Configuration: Low-Side
• Input Type: Non-Inverting
• Delay Time: 60ns
• Current - Peak: 4A
• Number Of Configurations: 2
• Voltage - Supply: 6.5 V ~ 24 V
• Mounting Type: Surface Mount
• Package / Case: 14-VFLGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Si823x
14. Land Pattern: 14 LD LGA with Thermal Pad
Figure 51 illustrates the recommended land pattern details for the Si8236 in a 14-pin LGA with thermal pad.
Table 25 lists the values for the dimensions shown in the illustration.
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Table 25. 14-Pin LGA with Thermal Pad Land Pattern Dimensions
Notes:
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least
4. All metal pads are to be non-solder mask defined (NSMD). Clearance
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
Figure 51. 14-Pin LGA with Thermal Pad Land Pattern
Material Condition (LMC) is calculated based on a Fabrication
Allowance of 0.05 mm.
between the solder mask and the metal pad is to be 60 µm minimum, all
the way around the pad.
walls should be used to assure good solder paste release.
specification for Small Body Components.
Dimension
C1
C2
D2
X1
Y1
E
Rev. 1.1
(mm)
4.20
1.50
4.25
0.65
0.80
0.40