PUMH18,115 NXP Semiconductors, PUMH18,115 Datasheet
PUMH18,115
Specifications of PUMH18,115
PUMH18 T/R
PUMH18 T/R
Related parts for PUMH18,115
PUMH18,115 Summary of contents
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PEMH18; PUMH18 NPN/NPN resistor-equipped transistors 4.7 kΩ kΩ Rev. 03 — 20 November 2009 1. Product profile 1.1 General description NPN/NPN Resistor-Equipped Transistors (RET). Table 1. Type number PEMH18 PUMH18 1.2 Features Built-in bias resistors ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number PEMH18 PUMH18 4. Marking Table 5. Type number PEMH18 PUMH18 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PEMH18_PUMH18_3 Product data sheet NPN/NPN resistor-equipped transistors 4.7 kΩ kΩ Pinning Description ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot T stg amb Per device P tot [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol Per transistor R th(j-a) Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table 8. ° amb Symbol Per transistor I CBO I CEO I EBO h FE ...
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... NXP Semiconductors − 100 °C (1) T amb = 25 °C (2) T amb = −40 °C (3) T amb Fig 1. DC current gain as a function of collector current; typical values I(on) ( −1 10 − 0 −40 °C (1) T amb = 25 °C (2) T amb = 100 °C (3) T amb Fig 3. On-state input voltage as a function of collector current ...
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... NXP Semiconductors 8. Package outline 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 0.3 0.65 0.2 1.3 Dimensions in mm Fig 5. Package outline SOT363 (SC-88) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description ...
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... Revision history Document ID Release date PEMH18_PUMH18_3 20091120 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 5 “Package outline SOT363 PEMH18_PUMH18_2 20050609 PUMH18_1 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information . . . . . . . . . . . . . . . . . . . . . 6 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 Legal information ...