TEA6849H/V1-T NXP Semiconductors, TEA6849H/V1-T Datasheet - Page 2

• Manufacturer Part Number: TEA6849H/V1-T
• Description: Tuners NICE/PACS SONY
• Manufacturer: NXP Semiconductors

Specifications of TEA6849H/V1-T

• Bus Type: I2C
• Maximum Agc: 89 dB
• Maximum Frequency: 9.99 MHz, 108 MHz
• Minimum Frequency: 5.73 MHz, 65 MHz
• Modulation Technique: AM, FM
• Mounting Style: SMD/SMT
• Package / Case: LQFP-80
• Function: Radio
• Noise Figure: 16 dB, 4.5 dB
• Operating Supply Voltage: 8.5 V
• Supply Voltage (min): 8 V
• Supply Voltage (max): 9 V
• Minimum Operating Temperature: - 40 C
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TEA6849H/V1,518

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
7.1
7.1.1
7.1.2
7.1.3
7.2
7.3
7.3.1
7.3.2
7.3.3
7.3.4
7.3.5
7.3.6
7.3.7
7.3.8
7.3.9
7.3.10
7.3.11
7.4
7.4.1
7.4.2
7.4.3
7.4.4
7.5
8
9
2003 Dec 19
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Oscillators
VCO
PLL
Crystal oscillator
DAA
FM signal channel
FM mixer 1
Buffer output for weather band flag
(pin WBFLAG)
FM keyed AGC
FM IF amplifier
FM mixer 2
FM IF2 dynamic selectivity
FM quadrature demodulator
FM MPX soft mute
Adjacent channel detector and threshold
extension
Bandwidth control ‘active’ flag (pin IFBWFLAG)
Bandwidth control monitor voltage (pin V
AM signal channel
AM tuner including mixer 1 and mixer 2
AM RF AGC
AM detector
AM noise blanker
FM and AM level detector
LIMITING VALUES
THERMAL CHARACTERISTICS
IFBW
)
2
10
11
12
12.1
12.1.1
12.1.2
12.1.3
12.1.4
12.2
12.2.1
12.2.2
12.2.3
12.2.4
12.2.5
12.2.6
12.2.7
12.2.8
12.2.9
12.2.10
13
14
15
16
16.1
16.2
16.3
16.4
16.5
17
18
19
20
DC CHARACTERISTICS
AC CHARACTERISTICS
I
I
Data transfer
I
Frequency setting
Default settings
I
Data transfer mode and IC address
Write mode: data byte 0
Write mode: data byte 1
Write mode: data byte 2
Write mode: data byte 3
Write mode: data byte 4
Write mode: data byte 5
Write mode: data byte 6
Write mode: data byte 7
Read mode: data byte 0
TEST AND APPLICATION INFORMATION
INTERNAL CIRCUITRY
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
2
2
2
C-BUS PROTOCOL
C-bus specification
C-bus pull-up resistors
C-bus protocol
Product specification
2
TEA6849H
C COMPONENTS