HB1V15-LP TE Connectivity, HB1V15-LP Datasheet
HB1V15-LP
Manufacturer Part Number
HB1V15-LP
Description
Manufacturer
TE Connectivity
Datasheet
1.HB1V15-LP.pdf
(2 pages)
Specifications of HB1V15-LP
Operating Temp Range
0C to 70C
Mounting
Surface Mount
Pin Count
24
Insertion Loss (max)
1.4dB
Isolation Voltage (max)
1500VrmsV
Lead Style
Gull Wing
Ocl Inductance (max)
0.35(Min)mH
Operating Temperature Max Deg. C
70C
Operating Temperature Min Deg. C
0C
Product Depth (mm)
19.05mm
Product Height (mm)
5.85mm
Product Length (mm)
13.76mm
Return Loss (min)
10dB
Turns Ratio
1:1
Lead Free Status / RoHS Status
Not Compliant
TEL 888-978-2638 - FAX 605-886-8995 -
±0.002 [0.051](24X)
(HB1Vxx-LP)
Description
0.016 [0.41]
MGH1V
Product
0.010 [0.26]
Series
All dimensions are in inches [millimeters].
All dimensions are ±0.005 [0.127] unless otherwise noted.
The information contained in this drawing is the sole property of Tyco Electronics Corporation
REV
M
0.750 [19.05]
0.600 [15.23]
0.230 [5.85] Max
Single port interface for 10/100Mbps Ethernet applications
Cable side data pairs capable to 350MA DC
Designed for IP phone or switch applications
Compact footprint
Low profile package
Compliant with IEEE 802.3 and ANSI X3.263 Standards
OCL of 350uH min. when biased at 8mA from 0°C to 70°C
Surface mount package designed for reflow process (240°C peak)
Tape and Reel packaging is standard
Package molding using UL94-V0 rated material
Specifications subject to change without notice. For latest revision visit
10/100BASE-T Magnetics, VolP/Power Applications
0.542 [13.76]
Standard Features
Max
Single Port, Surface Mount Modules
0.039 [0.99](22X)
24 Surfaces
0.004 [0.01]
0.429 [10.90]
0.039 [0.99] Typ
Suggested Pad Layout
Sheet 1 of 2
0.610 [15.49]
0.770 [19.56]
www.tycopowercomponents.com
0.010 [0.25]
0.025 [0.63] (24X)
4/1/2005
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HB1V15-LP Summary of contents
Page 1
MGH1V REV (HB1Vxx-LP) M Series Product Description Single port interface for 10/100Mbps Ethernet applications Cable side data pairs capable to 350MA DC Designed for IP phone or switch applications Compact footprint Low profile package Compliant with IEEE 802.3 and ANSI ...
Page 2
... See Table 6 Chip Side 7 8 CMC2 1 Part Number Table Part Number TX Turns Ratio Schematic HB1V09-LP 1.41:1 HB1V14-LP 1:1 HB1V15-LP 1:1 HB1V26-LP 1:1 HB1V38-LP 1.41:1 HB1V39-LP 1.41 Transmit Receive CMRR CMRR (dB Min) (dB Min) (dB Min) 43.0 42.0 42.0 43.0 42.0 42.0 43.0 42.0 42 ...