CE-PHSA RadiSys, CE-PHSA Datasheet

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CE-PHSA

Manufacturer Part Number
CE-PHSA
Description
Manufacturer
RadiSys
Datasheet

Specifications of CE-PHSA

Lead Free Status / RoHS Status
Compliant
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FEATURE SUMMARY
1.4GHz Low Power
Pentium M 738 combined
with Intel 915GM Chipset
on a COM Express
Module
Extended Temperature
Range: -25°C to 70°C
Intel ICH6M I/O Hub
PICMG COM Express
Compliant
FEATURE
PHYSICAL
Procelerant CE738AE Specifications
[Print This Datasheet]
Procelerant CE738AE
Extended Temperature Range COM Express Module
Based on the open PICMG standard, the RadiSys Procelerant™ CE738A-E module provides low
power and high performance over an extended temperature range of -25°C – 70°C, critical for
temperature sensitive COM Express embedded applications. Paired with a RadiSys Procelerant
CR carrier board, the RadiSys family of COM Express modules provides a final production or a
design-specific development platform
PICMG STANDARD
COM Express is the PICMG standard for a Computer-On-Module (COM) base on new serial
differential signaling technologies such as PCI Express, Serial ATA, USB 2.0, LVDS, and Serial
DVO. The COM Express modular concept enables OEMs to reduce time to market by reducing the
time spent on processor design and enabling OEMs to focus on their core competencies and
product differentiation. The modularity provides the ability for an OEM to plan for feature changes,
demand fluctuations and performance upgrades without having to re-design their product. The
RadiSys COM Express modules can reduce service repair inventories, simplify debugging and
reduce field service time contributing to the success of the product over its lifetime.
APPLICATIONS
RadiSys CE738A-E COM Express module is ideal for rugged embedded applications that require
extended temperature operations in addition to the small footprint and modular flexibility benefits of
COM Express. These modules are compact and reliable solutions for meeting the rigors of
transportation, military, industrial and medical applications requirements.
CARRIER DESIGNS SUPPORTED BY RADISYS
Whether customers design their own carrier board or utilize RadiSys Design Services to design one,
RadiSys supports the design each step of the way. Tools such as the Carrier Design Guide and
Thermal Design Guide, as well as schematics and Gerber files are available for customers
committed to using RadiSys Procelerant CE processor modules. Ask your RadiSys Sales Manager
for more information.
Procelerant CE738AE DATA SHEET | © 2009 RadiSys Corporation | ID: 10-30-2008 7 | Page 2 of 4
 * All other trademarks are the properties of their  respective owners. 
FUNCTION
Dimensions
DESCRIPTION
95mm x 125mm – COM Express Basic Form Factor

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CE-PHSA Summary of contents

Page 1

... Thermal Design Guide, as well as schematics and Gerber files are available for customers committed to using RadiSys Procelerant CE processor modules. Ask your RadiSys Sales Manager for more information. Procelerant CE738AE DATA SHEET | © 2009 RadiSys Corporation | ID: 10-30-2008 7 | Page  * All other trademarks are the properties of their  respective owners.  Procelerant CE738AE Specifications ...

Page 2

... Up to 1GB DDR2 in a single channel BIOS Type 1MB, Phoenix Technologies AUDIO Compliance AC ‘ 97 Intel High Definition Audio via ICH6M I/O Hub VIDEO Type Dual Independent Displays via Intel 915GM Chipset Features Dual SVDO, LVDS 18-bit dual channel, Analog VGA, TV Out ...

Page 3

... Range, 512MB Supporting Products: CR202-PCIE16: Development ATX carrier board with 16-bit PCI- Express CE-PHSA: Passive Heatsink & Assembly CE-PHS17A: Low Profile Passive CE-TIM: Thermal Interface Material, required with Heatsinks CE-DVI-VGA: DVI to VGA cable 2009 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation ...

Page 4

... Range, 512MB Supporting Products: CR202-PCIE16: Development ATX carrier board with 16-bit PCI- Express CE-PHSA: Passive Heatsink & Assembly CE-PHS17A: Low Profile Passive CE-TIM: Thermal Interface Material, required with Heatsinks CE-DVI-VGA: DVI to VGA cable 2009 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9 are registered trademarks of RadiSys Corporation ...

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