MT46V16M16CY-6 IT:K Micron Technology Inc, MT46V16M16CY-6 IT:K Datasheet - Page 28
![DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 60-Pin FBGA Tray](/photos/31/34/313422/mfg557-60-fbga_sml.jpg)
MT46V16M16CY-6 IT:K
Manufacturer Part Number
MT46V16M16CY-6 IT:K
Description
DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 60-Pin FBGA Tray
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46V16M16CY-6_ITK.pdf
(93 pages)
Specifications of MT46V16M16CY-6 IT:K
Density
256 Mb
Maximum Clock Rate
333 MHz
Package
60FBGA
Address Bus Width
15 Bit
Operating Supply Voltage
2.5 V
Maximum Random Access Time
0.7 ns
Operating Temperature
-40 to 85 °C
Organization
16Mx16
Address Bus
15b
Access Time (max)
700ps
Operating Supply Voltage (typ)
2.5V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Supply Current
270mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
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Table 19:
PDF: 09005aef80768abb/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN
AC Characteristics
Parameter
DQS write preamble setup time
DQS write postamble
Write recovery time
Internal WRITE-to-READ command delay
Exit SELF REFRESH-to-non-READ command
Exit SELF REFRESH-to-READ command
Data valid output window
Electrical Characteristics and Recommended AC Operating Conditions (-6) (continued)
Notes: 1–6, 16–18, 34 apply to the entire table; Notes appear on page 35;
0°C ≤ T
A
≤ +70°C; V
DD
Q = +2.5V ±0.2V, V
DD
= +2.5V ±0.2V
26
Symbol
t
WPRES
t
t
t
t
WPST
XSNR
XSRD
t
WTR
n/a
WR
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Electrical Specifications – DC and AC
Min
256Mb: x4, x8, x16 DDR SDRAM
200
0.4
15
75
0
1
t
QH -
-6 (FBGA)
t
DQSQ
Max
0.6
–
–
–
–
–
©2003 Micron Technology, Inc. All rights reserved.
Units
t
t
t
ns
CK
ns
CK
ns
CK
ns
Notes
21, 22
20
26
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