MT47H64M16HR-25E:H TR Micron Technology Inc, MT47H64M16HR-25E:H TR Datasheet - Page 24
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MT47H64M16HR-25E:H TR
Manufacturer Part Number
MT47H64M16HR-25E:H TR
Description
64MX16 DDR2 SDRAM PLASTIC PBF FBGA 1.8V
Manufacturer
Micron Technology Inc
Datasheet
1.MT47H64M16HR-25EH_TR.pdf
(134 pages)
Specifications of MT47H64M16HR-25E:H TR
Lead Free Status / Rohs Status
Compliant
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Table 6: Temperature Limits
Figure 11: Example Temperature Test Point Location
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Parameter
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
Operating temperature: automotive
Notes:
Test point
1. MAX storage case temperature T
2. MAX operating case temperature T
3. Device functionality is not guaranteed if the device exceeds maximum T
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
in Figure 11. This case temperature limit is allowed to be exceeded briefly during pack-
age reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering
Parameters.”
in Figure 11.
tion.
Lmm x Wmm FBGA
Width (W)
0.5 (W)
0.5 (L)
Length (L)
Electrical Specifications – Absolute Ratings
24
STG
Symbol
C
T
Micron Technology, Inc. reserves the right to change products or specifications without notice.
is measured in the center of the package, as shown
T
T
T
T
T
STG
is measured in the center of the package, as shown
A
A
C
C
C
1Gb: x4, x8, x16 DDR2 SDRAM
Min
–55
–40
–40
–40
–40
0
Max
150
105
105
85
95
85
© 2004 Micron Technology, Inc. All rights reserved.
Units
°C
°C
°C
°C
°C
°C
C
during opera-
Notes
2, 3, 4
2, 3, 4
2, 3
4, 5
4, 5
1
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