BTA312X-800E,127 NXP Semiconductors, BTA312X-800E,127 Datasheet - Page 5

TRIAC 800V 12A TO-220F

BTA312X-800E,127

Manufacturer Part Number
BTA312X-800E,127
Description
TRIAC 800V 12A TO-220F
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BTA312X-800E,127

Package / Case
TO-220-3 Full Pack
Mounting Type
Through Hole
Configuration
Single
Current - Hold (ih) (max)
15mA
Voltage - Off State
800V
Current - Gate Trigger (igt) (max)
10mA
Current - Non Rep. Surge 50, 60hz (itsm)
95A, 105A
Current - On State (it (rms) (max)
12A
Voltage - Gate Trigger (vgt) (max)
1.5V
Triac Type
Logic - Sensitive Gate
Rated Repetitive Off-state Voltage Vdrm
800 V
Breakover Current Ibo Max
105 A
On-state Rms Current (it Rms)
12 A
Off-state Leakage Current @ Vdrm Idrm
0.1 mA
Gate Trigger Voltage (vgt)
0.4 V
Gate Trigger Current (igt)
10 mA
Holding Current (ih Max)
15 mA
Forward Voltage Drop
1.3 V
Mounting Style
Through Hole
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Repetitive Peak Forward Blocking Voltage
800 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934060045127::BTA312X-800E::BTA312X-800E
NXP Semiconductors
5. Thermal characteristics
Table 4.
6. Isolation characteristics
Table 5.
T
BTA312X_SER_D_E_1
Product data sheet
Symbol
R
R
Symbol
V
C
h
Fig 6. Transient thermal impedance from junction to heatsink as a function of pulse duration
isol(RMS)
th(j-h)
th(j-a)
isol
= 25 C unless otherwise specified.
Z
(K/W)
(1) Unidirectional (half cycle) without heatsink compound
(2) Unidirectional (half cycle) with heatsink compound
(3) Bidirectional (full cycle) without heatsink compound
(4) Bidirectional (full cycle) with heatsink compound
th(j-h)
10
10
10
10
1
1
2
3
10
5
Thermal characteristics
Isolation limiting values and characteristics
Parameter
RMS isolation voltage from all three terminals to
isolation capacitance
Parameter
thermal resistance from junction to
heatsink
thermal resistance from junction to
ambient
10
4
Conditions
external heatsink; f = 50 Hz to
60 Hz; sinusoidal waveform;
RH
from pin 2 to external heatsink;
f = 1 MHz
10
65 %; clean and dust free
3
Rev. 01 — 16 April 2007
Conditions
full or half cycle; without
heatsink compound; see
Figure 6
full or half cycle; with
heatsink compound; see
Figure 6
in free air
10
2
BTA312X series D and E
(1)
(2)
12 A Three-quadrant triacs high commutation
(3)
(4)
10
Min
-
-
1
Min
-
-
-
Typ
-
10
Typ
-
-
55
1
P
t
t
p
Max
2500
-
© NXP B.V. 2007. All rights reserved.
p
Max
5.5
4.5
-
(s)
003aab672
t
10
Unit
K/W
K/W
K/W
Unit
V
pF
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