BBY40,215 NXP Semiconductors, BBY40,215 Datasheet
BBY40,215
Specifications of BBY40,215
933505310215
BBY40 T/R
Related parts for BBY40,215
BBY40,215 Summary of contents
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DATA SHEET alfpage BBY40 VHF variable capacitance diode Product specification Supersedes data of November 1993 DISCRETE SEMICONDUCTORS M3D088 1996 May 03 ...
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... NXP Semiconductors VHF variable capacitance diode FEATURES Excellent linearity Small plastic SMD package C25: 4.6 pF; ratio: 5.5. APPLICATIONS Electronic tuning in VHF television tuners, band 160 MHz. DESCRIPTION The BBY40 is a variable capacitance diode, fabricated in planar technology, and encapsulated in the SOT23 small plastic SMD package ...
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... NXP Semiconductors VHF variable capacitance diode GRAPHICAL DATA 50 handbook, full pagewidth C d (pF − MHz Fig.2 Diode capacitance as a function of reverse voltage; typical values handbook, halfpage I R (nA Fig.3 Reverse current as a function of junction temperature; maximum values. 1996 May 03 1 MLC816 10 handbook, halfpage TC − ...
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... NXP Semiconductors VHF variable capacitance diode PACKAGE OUTLINE Plastic surface-mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max. 1.1 0.48 0.15 mm 0.1 0.9 0.38 0.09 OUTLINE VERSION IEC SOT23 1996 May scale 3.0 1.4 2.5 1.9 0.95 2.8 1.2 2.1 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...