125700D00000G Aavid Thermalloy, 125700D00000G Datasheet - Page 26

• Manufacturer Part Number: 125700D00000G
• Description: SOLDER ANCHOR FOR BGA HEATSINKS
• Manufacturer: Aavid Thermalloy
• Type: Passiver

Specifications of 125700D00000G

• Accessory Type: Solder Anchor (2 required)
• Device Cooled: BGA
• Attachment Method: Clip
• Product Depth: 2.49 mm
• Product Height: 7.19 mm
• Product Length: 7.62 mm
• Product: Hardware & Accessories
• Mounting Style: SMD/SMT
• Dimensions: 7.62 mm L x 2.49 mm W x 7.19 mm H
• For Use With/related Products: BGA Heat Sinks
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: HS400

26
FIGURE A
Recommended copper heat speader drain pad footprint
Recommended copper pad size
for heat sink and device mounting footprint
Note: The thickness of
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design limita-
tions and process.
FIGURE C
www.aavidthermalloy.com
SMT Footprints
For D Pak (TO-263)
(0.420)
(0.610)
10.67
15.49
Part Number
573100
573300
573400
(0.410)
(0.090)
10.41
2.29
14.22 (0.560)
14.22 (0.560)
9.53 (0.375)
“L”
AMERICA
EUROPE
13.97 (0.550)
16.26 (0.640)
21.08 (0.830)
W
“W”
Italy Tel: [phone] email: [e-mail]
United Kingdom Tel: [phone] email: [e-mail]
USA Tel: [phone] email: [e-mail]
For MO-184 and SO-10
(0.300)
7.62
L
(0.610)
15.49
Recommended heat sink solder mask opening
FIGURE D
Recommended copper pad size
for heat sink and device mounting footprint
FIGURE B
Part Number
573100
573300
573400
(0.030)
0.80
ASIA
13.72 (0.540)
13.72 (0.540)
9.02 (0.355)
“L”
Singapore Tel: [phone] email: [e-mail]
Taiwan Tel: [phone] email: [e-mail]
(0.660)
(0.420)
16.76
10.67
W
W
1
2
13.46 (0.530)
15.75 (0.620)
20.57 (0.810)
“W1”
(0.100)
(0.100)
2.54
L
2.54
(0.060)
1.40
(0.800)
11.18 (0.440)
16.00 (0.630)
20.32
8.89 (0.350)
“W2”