BDN18-6CB/A01 CTS Thermal Management Products

HEATSINK CPU W/ADHESIVE 1.81"SQ

BDN18-6CB/A01

Manufacturer Part Number

BDN18-6CB/A01

Description

HEATSINK CPU W/ADHESIVE 1.81"SQ

Manufacturer

CTS Thermal Management Products

Series

BDNr

Specifications of BDN18-6CB/A01

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Attachment Method

Thermal Tape, Adhesive (Included)

Outline

45.97mm x 45.97mm

Height

0.600" (15.20mm)

Thermal Resistance @ Forced Air Flow

2.8° C/W @ 400 LFM

Thermal Resistance @ Natural

8.1°C/W

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Power Dissipation @ Temperature Rise

-

Other names

294-1112
BDN186CBA01

Related parts for BDN18-6CB/A01

Related keywords

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BDN18-6CB/A01 RoHS