BDN18-3CB/A01 CTS Thermal Management Products

HEATSINK CPU W/ADHESIVE 1.81"SQ

BDN18-3CB/A01

Manufacturer Part Number

BDN18-3CB/A01

Description

HEATSINK CPU W/ADHESIVE 1.81"SQ

Manufacturer

CTS Thermal Management Products

Series

BDNr

Specifications of BDN18-3CB/A01

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Attachment Method

Thermal Tape, Adhesive (Included)

Outline

45.97mm x 45.97mm

Height

0.35" (9mm)

Thermal Resistance @ Forced Air Flow

3.5°C/W @ 400 LFM

Thermal Resistance @ Natural

10.8°C/W

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Power Dissipation @ Temperature Rise

-

Other names

294-1104

Related parts for BDN18-3CB/A01

Related keywords

BDN18-3CB/A01 component
BDN18-3CB/A01 part
BDN18-3CB/A01 distributor
BDN18-3CB/A01 RoHS