D10650-40 Wakefield Thermal Solutions, D10650-40 Datasheet - Page 9

• Manufacturer Part Number: D10650-40
• Description: HEATSINK 100PQFP COMPOSITE
• Manufacturer: Wakefield Thermal Solutions

Specifications of D10650-40

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 16.51mm x 16.51mm
• Height: 0.4" (10.16mm)
• Power Dissipation @ Temperature Rise: 2W @ 40°C
• Thermal Resistance @ Forced Air Flow: 25°C/W @ 350 LFM
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Plastic
• Fin Style: Pin
• Dimensions: 16.51 mm L x 10.16 mm W x 16.51 mm H
• Designed For: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1076; D1065040

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Designed to fit a .063” thick PCB
electronic package thickness of .110”
See 609 Series for PCB hole layout for clip attachment
DIM.
“A”
619 95 AB 124 D1 S3
2.808
Thermal Interface Material Option
Blank
S5
S6
S3
S4
5
4
3
2
1
0
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
Bergquist Qpad 3
Bergquist Softface
Chomerics T710
Chomerics T443
*
609-100AB
100
None
609-50AB
AIR VELOCITY (LFM)
200
300
400
500