LM556CM/HAPB National Semiconductor, LM556CM/HAPB Datasheet - Page 3

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LM556CM/HAPB

Manufacturer Part Number
LM556CM/HAPB
Description
Manufacturer
National Semiconductor
Type
Standardr
Datasheet

Specifications of LM556CM/HAPB

# Internal Timers
2
Power Dissipation
410mW
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (typ)
5/9/12/15V
Operating Supply Voltage (max)
16V
Package Type
SOIC N
High Level Output Current
-200mA
Low Level Output Current
200mA
Pin Count
14
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant
Supply Voltage
Supply Current
Timing Error, Monostable
Timing Error, Astable
Trigger Voltage
Trigger Current
Reset Voltage
Reset Current
Threshold Current
Control Voltage Level and
Threshold Voltage
Pin 1, 13
Leakage Output High
Pin 1, 13 Sat
Output Voltage Drop (Low)
Electrical Characteristics
(T
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
(Each Timer Section)
Initial Accuracy
Drift with Temperature
Accuracy over Temperature
Drift with Supply
Initial Accuracy
Drift with Temperature
Accuracy over Temperature
Drift with Supply
Output Low
Output Low
Power Dissipation (Note 2)
Operating Temperature Ranges
A
LM556CM
LM556CN
LM556C
= 25˚C, V
Parameter
CC
= +5V to +15V, unless otherwise specified)
V
V
(Low State) (Note 3)
R
C = 0.1µF, (Note 4)
R
C = 0.1µF, (Note 4)
V
V
V
V
V
V
(Note 7)
V
V
V
I
I
I
I
V
I
I
SINK
SINK
SINK
SINK
SINK
SINK
CC
CC
CC
CC
TH
TH
CC
CC
CC
CC
CC
CC
A
A
, R
= 1k to 100k ,
(Note 1)
0˚C to +70˚C
= V-Control (Note 6)
= 11.2V
= 5V, R
= 15V, R
= 15V
= 5V
= 15V
= 5V
= 15V, I = 15mA
= 4.5V, I = 4.5mA
= 15V
= 5V
= 10mA
= 50mA
= 100mA
= 200mA
= 8mA
= 5mA
B
= 1k to 100k ,
1620 mW
410 mW
+18V
L
Conditions
L
=
=
3
Storage Temperature Range
Soldering Information
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering
surface mount devices.
Dual-In-Line Package
Small Outline Packages
Soldering (10 Seconds)
Vapor Phase (60 Seconds)
Infrared (15 Seconds)
1.25
Min
4.5
4.5
0.4
2.6
9
LM556C
Limits
0.75
2.25
0.30
1.67
0.03
3.33
0.25
Typ
150
180
1.5
0.1
3.0
0.2
0.5
0.1
0.1
0.4
2.5
10
50
10
80
3
5
1
2
Max
0.25
0.75
2.75
0.35
−65˚C to +150˚C
250
100
300
200
5.5
2.0
1.0
0.6
0.1
16
14
11
6
1
4
www.national.com
ppm/˚C
ppm/˚C
Units
260˚C
215˚C
220˚C
%/V
%/V
mA
mA
mV
mV
µA
µA
nA
nA
%
%
%
%
V
V
V
V
V
V
V
V
V
V
V

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