PX1012A-EL,551 NXP Semiconductors, PX1012A-EL,551 Datasheet - Page 3

• Manufacturer Part Number: PX1012A-EL,551
• Manufacturer: NXP Semiconductors

Specifications of PX1012A-EL,551

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Philips Semiconductors
4. Ordering information
Table 2.
5. Marking
PX1011A_PX1012A_2
Product data sheet
Type number
PX1011A-EL1
PX1011A-EL1/G
PX1011AI-EL1/G Pb-free (SnAgCu
PX1012A-EL1/G
PX1012AI-EL1/G Pb-free (SnAgCu
Ordering information
Solder process
SnPb solder ball
compound
Pb-free (SnAgCu
solder ball compound)
solder ball compound)
Pb-free (SnAgCu
solder ball compound)
solder ball compound)
Table 3.
Table 4.
[1]
Line
A
B
C
Line
A
B
C
Industrial temperature range.
Marking
PX1011A-EL1
xxxxxxx
2PNyyww
Marking
PX1011A-EL1/G
PX1012A-EL1/G
PX1011AI-EL1/G
PX1012AI-EL1/G
xxxxxxx
2PGyyww
Leaded package marking
Lead-free package marking
Package
Name
LFBGA81
LFBGA81
LFBGA81
LFBGA81
LFBGA81
Rev. 02 — 18 May 2006
[1]
[1]
Description
full basic type number
diffusion lot number
manufacturing code:
Description
full basic type number
diffusion lot number
manufacturing code:
Description
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
2 = diffusion site
P = assembly site
N = leaded
yy = year code
ww = week code
2 = diffusion site
P = assembly site
G = lead-free
yy = year code
ww = week code
9
9
9
9
9
PX1011A/PX1012A
1.05 mm
1.05 mm
1.05 mm
1.05 mm
1.05 mm
PCI Express stand-alone X1 PHY
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Version
SOT643-1
SOT643-1
SOT643-1
SOT643-1
SOT643-1
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