AM79C202JC AMD (ADVANCED MICRO DEVICES), AM79C202JC Datasheet - Page 31

• Manufacturer Part Number: AM79C202JC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM79C202JC

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Thermal Management Equations (Normal Active and Tip Open States)
Thermal Management equations (Polarity Reverse State)
Note: ASLIC device die temperature should not exceed 140°C.
Z
Z
R
P
P
P
T
ThetajA
RTMG
SLIC
SLIC
T
RX
SLIC
TMG
=
=
63.5
=
=
=
=
----------- -
G
=
Z
V
V
P
42L
V
------------------------------------ -
L
---------------------------------------------------------------------------------- -
SLIC
jA
BAT
BAT
BAT
V
BAT
Z
I
=
LOOP
2WIN
-------------------------------------------------------- -
Z
–
T
43 C watt
I
I
VOFF
–
+
LOOP
LOOP
jA
VOFF
63.5
–
+
254 Z
2R
T
–
–
R
AMBIENT
F
TMG
P
–
R
RTMG
Z
L
L
T
I
LOOP
+
2R
I
–
LOOP
R
F
Table 9. User-Programmable Components
L
R
L
2
I
LOOP
+
2
0.12 W
P R E L I M I N A R Y
ASLIC/ASLAC Products
2
+
0.12 W
Z
resistors are R
ance. When computing Z
pole and any external stray capacitance between VTX and
RSN must be taken into account.
Z
and G
R
duce power dissipation within the ASLIC device in normal
Active and Tip Open states.
Power dissipated in the thermal management resistor,
R
Power dissipated in the ASLIC device while in normal Active
and Tip Open states
Power dissipated in the ASLIC device while in the polarity
reverse state
Total die temperature
Thermal impedance of the 32-pin plastic leaded chip carrier
package
T
RX
TMG
TMG
is connected between the VTX and RSN pins. The fuse
is connected from VRX to RSN. Z
, during normal Active and Tip Open states
42L
is connected from TMG to VBAT and is used to re-
is the desired receive gain.
F
. Z
2WIN
is the desired 2-wire AC input imped-
T
, the internal current amplifier
T
is defined above,
31