XC3SD3400A-4FGG676C Xilinx Inc, XC3SD3400A-4FGG676C Datasheet - Page 5

• Manufacturer Part Number: XC3SD3400A-4FGG676C
• Description: FPGA, SPARTAN-3A, DSP, 676FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3A DSPr

Specifications of XC3SD3400A-4FGG676C

• No. Of Logic Blocks: 5968
• No. Of Gates: 3400000
• No. Of Macrocells: 53712
• Family Type: Spartan-3A
• No. Of Speed Grades: 4
• Total Ram Bits: 2322432
• No. Of I/o's: 502
• Clock Management: DCM
• I/o Supply: RoHS Compliant
• Number Of Logic Elements/cells: 53712
• Number Of Labs/clbs: 5968
• Number Of I /o: 469
• Number Of Gates: 3400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 676-BBGA
• Package: 676FBGA
• Family Name: Spartan®-3A
• Device Logic Units: 53712
• Device System Gates: 3400000
• Maximum Internal Frequency: 667 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 469
• Ram Bits: 2322432
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 122-1532 - KIT DEVELOPMENT SPARTAN 3ADSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1539

Ordering Information
The Extended Spartan-3A family is available in both standard and Pb-free packaging options for all options of the
Spartan-3A devices and the Spartan-3A DSP devices, and for most options of the Spartan-3AN devices (see DS557,
Spartan-3AN FPGA Family: Introduction and Ordering Information for details).The Pb-free packages include a “G” character
in the ordering code (see
X-Ref Target - Figure 3
Notes:
1.
DS706 (v1.1) February 2, 2011
Product Specification
XC3S50A/AN
XC3S200A/AN
XC3S400A/AN
XC3S700A/AN
XC3S1400A/AN
XC3SD1800A
XC3SD3400A
The –5 speed grade is exclusively available in the Commercial temperature range.
Device
R
–4 Standard Performance
–5 High Performance
Speed Grade
Figure
3).
Device Type
Speed Grade
Package Type/Number of Pins
Temperature Range
VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP)
FT(G)256
TQ(G)144 144-pin Thin Quad Flat Pack (TQFP)
FG(G)320 320-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)400 400-ball Fine-Pitch Ball Grid Array (FBGA)
CS(G)484 484-ball Chip-Scale Ball Grid Array (FBGA)
FG(G)484 484-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)676 676-ball Fine-Pitch Ball Grid Array (FBGA)
Figure 3: Ordering Information
Example:
256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
Package Type / Number of Pins
www.xilinx.com
XC3S50A -4 FTG256 C
DS706_03_072508
Extended Spartan-3A Family Overview
C
LI
I
Temperature Range (T
Commercial (0°C to 85°C)
Industrial (–40°C to 100°C)
Low Power Industrial (–40°C
to 100°C) for Spartan-3A
DSP devices (see DS610,
Spartan-3A DSP FPGA Data
Sheet)
J
)
5