MC33981BHFK Freescale Semiconductor, MC33981BHFK Datasheet - Page 36

• Manufacturer Part Number: MC33981BHFK
• Description: HF 4.0MOHM RDSON SWITCH
• Manufacturer: Freescale Semiconductor

INTRODUCTION
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
PACKAGING AND THERMAL CONSIDERATIONS
independently heating with P
T
temperature while only heat source 1 is heating with P
reference temperature while heat source 2 is heating with P
R
This methodology is not meant to and will not predict the performance of a package in an application-specific environment. Stated
values were obtained by measurement and simulation according to the standards listed below.
STANDARDS
Table 8. Thermal Performance Comparison
36
33981
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
Notes
J1




This thermal addendum is provided as a supplement to the 33981 technical
This package is a dual die package. There are two heat sources in the package
For m, n = 1, R
For m = 1, n = 2, R
The stated values are solely for a thermal performance comparison of one package to another in a standardized environment.
J21
JAmn
JBmn
JAmn
JCmn
1.
2.
3.
4.
5.
and T
Resistance
Thermal
and R
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-7and
JESD51-5.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the power outputs.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
Thermal resistance between the die junction and the
exposed pad, “infinite” heat sink attached to exposed pad.
(1),
(2),
(1),
(5)
J2
(2)
(3)
(4)
, and a thermal resistance matrix with R
J22,
T
T
J1
J2
ADDITIONAL DOCUMENTATION
respectively.
JA11
=
THERMAL ADDENDUM (REV 3.0)
1 = Power Chip, 2 = Logic Chip [C/W]
m = 1,
n = 1
<1.0
JA12
is the thermal resistance from Junction 1 to the reference
7.0
22
62
R
R
JA11
JA21
is the thermal resistance from Junction 1 to the
1
and P
R
R
m = 1, n = 2
m = 2, n = 1
JA12
JA22
2
. This results in two junction temperatures,
4.0
0.0
18
48
.
P
P
1
2
m = 2,
n = 2
JAmn
1.0
41
27
81
1
.
.
2
. This applies to
Note: Recommended via diameter is 0.5 mm. PTH (plated through
hole) via must be plugged / filled with epoxy or solder mask in order
to minimize void formation and to avoid any solder wicking into the
via.
Figure 44. Surface mount for power PQFN
Note For package dimensions, refer to
98ARL10521D.
with exposed pads
Analog Integrated Circuit Device Data
12 MM X 12 MM
98ARL10521D
16-PIN PQFN
33981
16-PIN
PQFN
Freescale Semiconductor
0.2 mm spacing
between PCB pads
0.2 mm spacing
between PCB pads