MCP2022-330E/P Microchip Technology, MCP2022-330E/P Datasheet - Page 29

• Manufacturer Part Number: MCP2022-330E/P
• Description: IC,Automotive,LIN Transceiver,DIP,14PIN,PLASTIC
• Manufacturer: Microchip Technology
• Type: Transceiverr

Specifications of MCP2022-330E/P

• Number Of Drivers/receivers: 1/1
• Protocol: LIN
• Voltage - Supply: 6 V ~ 18 V
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
© 2009 Microchip Technology Inc.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
Dimension Limits
A1
E
A
Units
EXPOSED
D2
A1
A3
E2
N
A
D
E
K
e
b
L
PAD
NOTE 2
K
0.80
0.00
0.00
0.00
0.25
0.30
0.20
MIN
MILLIMETERS
b
0.80 BSC
0.20 REF
4.00 BSC
4.00 BSC
BOTTOM VIEW
NOM
0.90
0.02
2.20
3.00
0.30
0.55
8
–
Microchip Technology Drawing C04-131C
D2
2
MCP2021/2
e
1
MAX
1.00
0.05
2.80
3.60
0.35
0.65
N
–
DS22018E-page 29
E2
NOTE 1
L