PIC12F615-H/MD Microchip Technology, PIC12F615-H/MD Datasheet - Page 143

• Manufacturer Part Number: PIC12F615-H/MD
• Description: 1.75KB Flash, 64B RAM, 6 I/O, 8MHz Internal Oscillator 8 DFN 4x4mm TUBE
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F615-H/MD

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 5
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: FLASH
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C
• Package / Case: 8-DFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

16.0
Absolute Maximum Ratings
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum current sunk by GPIO ...................................................................................................................... 90 mA
Maximum current sourced GPIO...................................................................................................................... 90 mA
Note 1:
 2010 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
I
OL
DD
).
with respect to V
IK
(1)
OK
(V
DD
............................................................................................................................... 800 mW
I
SS
(Vo < 0 or Vo >V
< 0 or V
pin ......................................................................................................................... 95 mA
pin ...................................................................................................................... 95 mA
SS
PIC12F609/615/617/12HV609/615
I
> V
(†)
................................................................................................... -0.3V to +6.5V
DD
SS
)20 mA
DD
........................................................................... -0.3V to (V
)20 mA
DIS
= V
DD
x {I
DD
–  I
OH
} +  {(V
DD
– V
OH
) x I
DS41302D-page 143
OH
} + (V
DD
+ 0.3V)
O
l x