PIC24HJ128GP502-H/SO Microchip Technology, PIC24HJ128GP502-H/SO Datasheet - Page 346

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PIC24HJ128GP502-H/SO

Manufacturer Part Number
PIC24HJ128GP502-H/SO
Description
16-bit MCU, 128KB Flash, CAN, DMA, 40 MIPS, NanoWatt 28 SOIC .300in TUBE
Manufacturer
Microchip Technology
Series
PIC® 24Hr

Specifications of PIC24HJ128GP502-H/SO

Core Processor
PIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
128KB (43K x 24)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 140°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
DS70293E-page 346
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
E
EXPOSED
A
NOTE 1
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
PAD
E2
1
2
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
Microchip Technology Drawing C04-103B
D2
© 2011 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
K
e
b

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