IP4041CX25/LF/P,13 NXP Semiconductors, IP4041CX25/LF/P,13 Datasheet
IP4041CX25/LF/P,13
Specifications of IP4041CX25/LF/P,13
934061469135
Related parts for IP4041CX25/LF/P,13
IP4041CX25/LF/P,13 Summary of contents
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IP4041CX25 10-channel integrated filter network with ESD input protection to IEC 61000-4-2 level 4 Rev. 01 — 12 February 2010 1. Product profile 1.1 General description The IP4041CX25 is a 10-channel RC low-pass filter array which is designed to provide ...
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... NXP Semiconductors 2. Pinning information 2.1 Pinning Fig 1. 2.2 Pin description Table 1. Pin A1 and E1 A2 and E2 A3 and E3 A4 and E4 A5 and E5 B1 and D1 B2 and D2 B3 and D3 B4 and D4 B5 and Ordering information Table 2. Ordering information Type number Package Name IP4041CX25 ...
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... NXP Semiconductors 4. Functional diagram Fig 2. 5. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ESD tot T stg T reflow(peak) T amb Device is qualified with 1 000 pulses of ±15 kV contact discharges each, according to the IEC 61000-4-2 [1] model and far exceeds the specified level contact discharge). ...
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... NXP Semiconductors 6. Characteristics Table amb Symbol Parameter R s(ch Table amb Symbol Parameter α il α ct IP4041CX25_1 Product data sheet 10-channel integrated filter network with ESD input protection Channel characteristics ° C; unless otherwise specified. Conditions channel series resistance channel capacitance V bias(DC) breakdown voltage ...
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... NXP Semiconductors 7. Application information 7.1 Insertion loss The insertion loss measurement configuration of a typical 50 Ω NetWork Analyzer (NWA) system for evaluation of the IP4041CX25 is shown in The insertion loss of all channels for frequencies GHz is displayed in Fig 3. (dB) (1) Channel 10 (pins B5 and D5). (2) Channel 9 (pins B4 and D4). ...
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... NXP Semiconductors 7.2 Crosstalk The crosstalk measurement configuration of a typical 50 Ω NWA system for evaluation of the IP4041CX25 is shown in The measured crosstalk within the IP4041CX25 Ω NWA system from one channel to another is shown in (channels 1 and 2, channels 6 and 7) and the best case (channels 6 and 10, channels 1 and 5) conditions in terms of physical distance ...
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... NXP Semiconductors 8. Package outline WLCSP25: wafer level chip-size package; 25 bumps ( bump A1 index area European projection Fig 7. Package outline IP4041CX25 (WLCSP25) Table 6. Dimensions for Figure 7 Symbol IP4041CX25_1 Product data sheet 10-channel integrated filter network with ESD input protection Min Typ 0.60 0.65 ...
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... NXP Semiconductors 9. Design and assembly recommendations 9.1 PCB design guidelines For optimum performance it is recommended to use a Non-Solder Mask PCB Design (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance ...
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... NXP Semiconductors Table 9. Symbol T reflow(peak dT/dt 10. Abbreviations Table 10. Acronym DUT EMI ESD FR4 LAN NSMD PCB PCS RFI RoHS WAN WLCSP 11. Revision history Table 11. Revision history Document ID Release date IP4041CX25_1 20100212 IP4041CX25_1 Product data sheet 10-channel integrated filter network with ESD input protection ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information 7.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 Crosstalk Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Design and assembly recommendations ...