MT48LC8M16A2P-7E:G Micron Technology Inc, MT48LC8M16A2P-7E:G Datasheet - Page 29

IC, SDRAM 128MB, SMD, 48LC8, TSOP54

MT48LC8M16A2P-7E:G

Manufacturer Part Number
MT48LC8M16A2P-7E:G
Description
IC, SDRAM 128MB, SMD, 48LC8, TSOP54
Manufacturer
Micron Technology Inc
Type
SDRAMr
Series
-r
Datasheet

Specifications of MT48LC8M16A2P-7E:G

Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
5.4ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
165mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Access Time
RoHS Compliant
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Operating Temperature Max
70°C
Operating Temperature Min
0°C
Package / Case
TSOP
Memory Type
SDRAM
Memory Configuration
4 BLK (2M X 16)
Interface Type
LVTTL
Rohs Compliant
Yes
Format - Memory
RAM
Memory Size
128M (8Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC8M16A2P-7E:G
Manufacturer:
ANPEC
Quantity:
34 000
Part Number:
MT48LC8M16A2P-7E:G
Manufacturer:
MT
Quantity:
1 000
Part Number:
MT48LC8M16A2P-7E:G
Manufacturer:
MICRON-Pb free
Quantity:
1
Part Number:
MT48LC8M16A2P-7E:G
Manufacturer:
MICRON
Quantity:
20 000
Figure 15:
Figure 16:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
READ-to-WRITE
READ-to-WRITE with Extra Clock Cycle
Notes:
Notes:
The DQM signal must be de-asserted prior to the WRITE command (DQM latency is
zero clocks for input buffers) to ensure that the written data is not masked. Figure 15
shows the case where the clock frequency allows for bus contention to be avoided
without adding a NOP cycle, and Figure 16 shows the case where the additional NOP is
needed.
COMMAND
1. CL = 3 is used for illustration. The READ command may be to any bank, and the WRITE com-
COMMAND
1. CL = 3 is used for illustration. The READ command may be to any bank, and the WRITE com-
A fixed-length READ burst may be followed by, or truncated with, a PRECHARGE
command to the same bank (provided that auto precharge was not activated), and a full-
page burst may be truncated with a PRECHARGE command to the same bank. The
PRECHARGE command should be issued x cycles before the clock edge at which the last
ADDRESS
ADDRESS
mand may be to any bank. If a burst of 1 is used, then DQM is not required.
mand may be to any bank.
DQM
DQM
CLK
CLK
DQ
DQ
BANK,
COL n
T0
T0
BANK,
READ
COL n
READ
TRANSITIONING DATA
T1
T1
NOP
NOP
29
T2
T2
TRANSITIONING DATA
NOP
NOP
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T3
T3
NOP
NOP
D
OUT
t HZ
t HZ
D
OUT
t CK
n
n
DON’T CARE
T4
T4
BANK,
COL b
WRITE
NOP
D
IN
b
t
128Mb: x4, x8, x16 SDRAM
DS
DON’T CARE
T5
BANK,
COL b
WRITE
D
IN
b
t
©1999 Micron Technology, Inc. All rights reserved.
DS
Operations

Related parts for MT48LC8M16A2P-7E:G