SP000010093ZJ Infineon Technologies, SP000010093ZJ Datasheet - Page 5

• Manufacturer Part Number: SP000010093ZJ
• Manufacturer: Infineon Technologies

Specifications of SP000010093ZJ

• Operating Temperature (min): -40C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: RoHS Not Applicable

1
Table 1
Type
SLE 6636 C
SLE 6636 D
SLE 6636 M3
SLE 6636 MFC3
SLE 6636E C
SLE 6636E D
SLE 6636E M3
SLE 6636E MFC3
Additional ordering options: Counter tearing protection Enabled (on) or Disabled (off).
For more ordering information please contact your local Infineon sales office.
1)
2)
Short Product Information
Available as a Module Flip Chip (MFC3), wire-bonded module (M3) for embedding in plastic cards or as a die on
unsawn (C) / sawn wafer (D) for customer packaging
FCoS™ Flip Chip on Substrate
Ordering and Packaging information
Ordering Information
S-MFC3.1-6-1
Package
Die (on Wafer)
Die (on Wafer)
T-M3.2-6
S-MFC3.1-6-1
Die (on Wafer)
Die (on Wafer)
T-M3.2-6
1)
Remark
unsawn
sawn
FCoS™
unsawn
sawn
FCoS™
5 / 8
2)
2)
Ordering Code
on request
on request
on request
on request
on request
on request
on request
on request
SLE 6636 / SLE 6636E
Access of 3rd byte
Data of 3rd byte are
programmed by
Infineon exclusively
Data of 3rd byte are
programmed by the
card manufacturer at
personalization
Eurochip 66
2008-10-14