TFDU4301-TT1 Vishay, TFDU4301-TT1 Datasheet - Page 7

• Manufacturer Part Number: TFDU4301-TT1
• Manufacturer: Vishay

Specifications of TFDU4301-TT1

• Lead Free Status / RoHS Status: Supplier Unconfirmed

RECOMMENDED SOLDER PROFILES
Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU4301 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown below in
figure 5 and 6 are VISHAY's recommended profiles for use
with the TFDU4301 transceivers. For more details please
refer to the application note “SMD Assembly Instructions”.
A ramp-up rate less than 0.9 °C/s is not recommended.
Ramp-up rates faster than 1.3 °C/s could damage an optical
part because the thermal conductivity is less than compared
to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However,
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application note,
describing manual soldering and desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equivalent to
MSL4.
The data for the drying procedure is given on labels on the
packing and also in the application note “Taping, Labeling,
Storage and Packing”.
Document Number: 81965
Rev. 1.0, 22-Apr-10
19535
Fig. 4 - Recommended Solder Profile for Sn/Pb Soldering
260
240
220
200
180
160
140
120
100
80
60
40
20
0
(3.0-4.0)
0
for
2 to 4 °C/s
Ag
50
(0.5-0.9)
a
100
production
Cu, there are two standard reflow
Infrared Transceiver Module (SIR, 115.2 kbit/s)
[e-mail], [e-mail],
160 °C max.
240 °C max.
120 to180 s
150
Time/s
For technical questions within your region, please contact one of the following:
2 to 4 °C/s
200
process
90 s max.
10 s max. at 230 °C
250
for IrDA
it
300
cannot
®
350
Applications
be
TFDU Fig3
19532
280
240
200
160
120
275
250
225
200
175
150
125
100
80
40
75
50
25
0
0
0
0
Fig. 5 - Solder Profile, RSS Recommendation
[e-mail]
2 °C/s to 3 °C/s
50
50
T ≥ 217 °C for 70 s max.
Fig. 6 - RTS Recommendation
T ≥ 255 °C for 10 s....30 s
T
peak
100
1.3 °C/s
Vishay Semiconductors
100
Peak temperature T
90 s to 120 s
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
= 260 °C max.
150
Time/s
Time/s
150
200
peak
200
70 s max.
30 s max.
< 4 °C/s
TFDU4301
= 260 °C
250
< 2 °C/s
www.vishay.com
T
250
peak
2 °C/s to 4 °C/s
300
= 260 °C
300
350
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