HSDL-3602-007 Lite-On Electronics, HSDL-3602-007 Datasheet - Page 16

• Manufacturer Part Number: HSDL-3602-007
• Description: Infrared Transceivers IR Transceiver 4.0Mb/s
• Manufacturer: Lite-On Electronics
• Type: TX/RXr
• Series: -r

Specifications of HSDL-3602-007

• Pulse Width: 1.6/4us
• Led Supply Voltage: -0.5 to 7V
• Dimensions: 12.2x4.9x4
• Peak Wavelength: 875/880nm
• Angle Of Half Sensitivity: 60/30°
• Communication Distance: 150
• Fall Time: 40/25ns
• Rise Time: 40/25ns
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Mounting: Surface Mount
• Pin Count: 10
• Operating Temp Range: -20C to 70C
• Operating Temperature Classification: Commercial
• Data Rate: 3.90625Mbps
• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 1.5 m
• Radiant Intensity: 250 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Maximum Rise Time: 40 ns, 25 ns
• Maximum Fall Time: 40 ns, 25 ns
• Maximum Forward Current: 165 mA
• Operating Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Idle Current, Typ @ 25° C: 2.5mA
• Link Range, Low Power: 1m
• Operating Temperature: -20°C ~ 70°C
• Orientation: Side View
• Shutdown: Yes
• Size: 12.2mm x 4.9mm x 4mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.7 V ~ 3.6 V
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Compliant

16
3.0. Pick and Place Misalignment Tolerance and Product
Self-Alignment after Solder Reflow
If the printed solder paste volume is adequate, the
unit will self-align in the X-direction after solder reflow.
Units should be properly reflowed in IR Hot Air convec-
tion oven using the recommended reflow profile. The
direction of board travel does not matter.
2.0. Recommended solder paste/cream volume for castel-
lation joints
Based on calculation and experiment, the printed sol-
der paste volume required per castellation pad is 0.30
cubic mm (based on either no-clean or aqueous solder
cream types with typically 60 to 65% solid content by
volume).
Figure 4. Solder paste stencil aperture.
See Figure 4
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimension.
l
SOLDER
PASTE
mm
0.152
0.127
t, nominal stencil thickness
HSDL-3602 fig 4.0
inches
0.006
0.005
APERTURE AS PER
LAND
w
t (STENCIL THICKNESS)
2.1. Recommended Metal Solder Stencil Aperture
It is recommended that only 0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. The following combina-
tion of metal stencil aperture and metal stencil thick-
ness should be used:
Allowable Misalignment Tolerance
X-direction
Theta-direction
l, length of aperture
mm
2.8 ± 0.05
3.4 ± 0.05
≤ 0.2 mm (0.008 inches)
± 2 degrees
inches
0.110 ± 0.002
0.134 ± 0.002