MPC8270CVVUPEA Freescale, MPC8270CVVUPEA Datasheet - Page 58

• Manufacturer Part Number: MPC8270CVVUPEA
• Manufacturer: Freescale

Specifications of MPC8270CVVUPEA

• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 450MHz
• Instruction Set Architecture: RISC
• Operating Supply Voltage (max): 1.6V
• Operating Supply Voltage (min): 1.45V
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 480
• Package Type: TBGA
• Lead Free Status / RoHS Status: Compliant

Pinout
Figure 16
58
Not to Scale
Plated substrate via
shows the side profile of the PBGA package to indicate the direction of the top surface view.
AA
AB
AC
AD
AE
AF
A
U
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
V
W
Y
1 mm pitch
1
1
Transfer molding compound
2
2
3
3
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Figure 15. Pinout of the 516 PBGA Package (View from Top)
4 5 6
4 5 6
Figure 16. Side View of the PBGA Package Remove
7
7
8
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
attach
Die
DIE
Ball bond
Wire bonds
Screen-printed
solder mask
Cu substrate traces
BT resin glass epoxy
Freescale Semiconductor
A
U
V
W
Y
AD
AA
AB
AC
AE
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
AF