MCIMX253DJM4 Freescale, MCIMX253DJM4 Datasheet - Page 40

no-image

MCIMX253DJM4

Manufacturer Part Number
MCIMX253DJM4
Description
Manufacturer
Freescale
Datasheet

Specifications of MCIMX253DJM4

Operating Temperature (min)
-20C
Operating Temperature (max)
70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX253DJM4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCIMX253DJM4A
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCIMX253DJM4A
0
Note:
1. Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. Minimum condition for tpr, tpo, and tpv:
2. Minimum condition for tps: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
3. Maximum condition for tdit: bcs model, 1.3 V, I/O 3.6 V, and –40 °C.
4. Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 3.0 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
3.6.3.3
Table 29
40
Output pad dI/dt (max. drive)
Output pad dI/dt (high drive)
Output pad dI/dt (standard drive)
Input pad transition times
Input pad propagation delay, 50%–50%
Input pad propagation delay, 40%–60%
Duty cycle
Clock frequency
Output pad transition times
Output pad propagation delay, 50%–50%
Output pad propagation delay, 40%–60%
Output enable to output valid delay,
50%–50%
Output enable to output valid delay,
40%–60%
Output pad slew rate
bcs model, 1.3 V, I/O 3.6 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
between VIH to VIL for falling edge.
I/O 3.6 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
shows AC parameters for DDR2 I/O.
DDR_TYPE = 10 Max Setting I/O AC Parameters and Requirements
Parameter
Parameter
Table 28. AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O (continued)
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 7
Table 29. AC Parameters for DDR2 I/O
Symbol
Symbol
Fduty
tdit
tdit
tdit
tpo
tpo
tpv
tpv
tps
trfi
tpr
tpi
tpi
f
Condition
Condition
1.0 pF
1.0 pF
25 pF
25 pF
25 pF
50 pF
50 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
Load
Load
0.07/0.08
0.56/0.69
1.38/1.51
Rise/Fall
Rise/Fall
0.53/0.52
1.01/0.98
0.93/1.25
1.26/1.54
1.01/1.17
1.27/1.53
1.30/1.19
1.62/1.54
1.39/1.27
1.64/1.55
0.86/0.98
0.46/054
Min.
Min.
89
95
60
63
29
31
40
0.11/0.12 0.16/0.20
0.87/1.08 1.37/1.62
1.68/1.89 2.18/2.42
0.80/0.72
1.49/1.34
1.56/1.70
2.07/2.19
1.60/1.75
2.00/2.14
2.17/1.81
2.56/2.29
2.13/1.86
2.62/2.23
0.72/0.81
1.35/1.5
Typ.
Typ.
202
213
135
142
67
70
50
Rise/Fall
1.19/1.04
2.21/1.90
2.52/2.53
3.29/3.24
2.49/2.52
3.11/3.10
3.35/2.84
3.35/2.54
3.38/2.83
4.14/2.38
2.15/2.19
1.12/1.16
Rise/Fall
Max.
Max.
435
456
288
302
144
150
133
60
Freescale Semiconductor
mA/ns
mA/ns
mA/ns
Units
Units
MHz
V/ns
ns
ns
ns
ns
ns
ns
ns
%
Notes
Notes
3
4
1
1
1
1
1
2

Related parts for MCIMX253DJM4