54F182DMQB. National Semiconductor, 54F182DMQB. Datasheet - Page 5

54F182DMQB.

Manufacturer Part Number
54F182DMQB.
Description
Manufacturer
National Semiconductor
Datasheet

Specifications of 54F182DMQB.

Operating Temperature (max)
125C
Package Type
CDIP
Pin Count
14
Mounting
Through Hole
Lead Free Status / RoHS Status
Not Compliant
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
PLH
PHL
PLH
PHL
PLH
PHL
PLH
PHL
PLH
PHL
PLH
PHL
AC Electrical Characteristics
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
Temperature Range Family
Device Type
Package Code
74F
54F
SJ
D
P
F
L
Propagation Delay
C
Propagation Delay
P
C
Propagation Delay
G
C
Propagation Delay
P
Propagation Delay
G
Propagation Delay
P
0
1
n
e
e
e
e
e
e
e
n
n
n
0
n
a
a
to P
to C
to G
P
P
G
Commercial
Military
Plastic DIP
Ceramic DIP
Flatpak
Leadless Chip Carrier (LCC)
Small Outline SOIC EIAJ
x
x
1
2
1
C
C
Parameter
n
or P
or P
or G
n
n
a
a
a
x
2
3
y
y
2
C
to
to G
or C
or C
to
n
a
y
n
n
a
a
C
z
z
n
a
z
Min
3 0
3 0
2 5
1 5
2 5
1 5
3 0
3 0
3 0
3 0
3 0
2 5
V
T
C
74F
CC
A
L
e a
e
e a
Typ
74F
6 6
6 8
6 2
3 7
6 5
3 9
7 9
6 0
8 3
5 7
5 7
4 1
50 pF
182
25 C
5 0V
5
P
Max
10 0
10 5
8 5
9 0
8 0
5 0
8 5
5 2
8 0
7 5
7 5
5 5
C
QB
Min
T
3 0
3 0
2 5
1 0
2 5
1 0
3 0
2 5
3 0
2 5
2 5
2 5
C
A
Special Variations
Temperature Range
L
QB
V
C
M
e
54F
CC
e
e
50 pF
e
e
Commercial (0 C to
Military (
Military grade with
environmental and burn-in
processing shipped in tubes
Max
12 0
11 0
11 0
11 0
12 0
10 0
12 0
10 0
10 0
7 0
7 0
8 0
Mil
b
55 C to
T
Min
3 0
3 0
2 5
1 5
2 5
1 5
3 0
3 0
3 0
3 0
3 0
2 5
A
C
V
L
CC
e
a
74F
a
125 C)
50 pF
e
70 C)
Com
Max
10 0
11 0
11 5
9 5
9 0
6 0
9 5
6 0
9 0
8 5
8 5
6 5
Units
ns
ns
ns
ns
ns
ns

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