BAP64-02 NXP Semiconductors, BAP64-02 Datasheet - Page 2

• Manufacturer Part Number: BAP64-02
• Description: Planar PIN diode in a SOD523 ultra small plastic SMD package
• Manufacturer: NXP Semiconductors
• Type: Attenuator/Switchr

Specifications of BAP64-02

• Configuration: Single
• Forward Current: 100mA
• Forward Voltage: 1.1V
• Power Dissipation: 715mW
• Operating Temperature Classification: Military
• Reverse Voltage: 175V
• Package Type: I-IGIA
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 40@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 1.35@100mAOhm
• Typical Carrier Life Time: 1.55us
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 2
• Applications Frequency Range: SHF
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
FEATURES
APPLICATIONS
DESCRIPTION
Planar PIN diode in a SOD523 ultra small plastic SMD
package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
V
I
P
T
T
F
High voltage, current controlled
RF resistor for RF attenuators and switches
Low diode capacitance
Low diode forward resistance
Very low series inductance
For applications up to 3 GHz.
RF attenuators and switches.
stg
j
R
tot
Silicon PIN diode
SYMBOL
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
PARAMETER
Rev. 06 - 9 January 2008
T
s
= 90 C
PINNING
handbook, halfpage
Marking code: S.
Fig.1 Simplified outline (SOD523) and symbol.
CONDITIONS
PIN
1

2
1
T op view
2
cathode
anode
MAM405
MIN.
65
65
Product specification
DESCRIPTION
BAP64-02
175
100
715
+150
+150
MAX.
2 of 7
V
mA
mW
UNIT
C
C