BAP64LX T/R NXP Semiconductors, BAP64LX T/R Datasheet
BAP64LX T/R
Specifications of BAP64LX T/R
Related parts for BAP64LX T/R
BAP64LX T/R Summary of contents
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BAP64LX Silicon PIN diode Rev. 01 — 29 June 2007 1. Product profile 1.1 General description Planar PIN diode in a SOD882T leadless ultra small plastic SMD package. 1.2 Features I High voltage, current controlled RF resistor for RF attenuators ...
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... NXP Semiconductors 4. Marking Table 3. Type number BAP64LX 5. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot T stg Thermal characteristics Table 5. Symbol R th(j-sp) 7. Characteristics Table 6. Characteristics unless otherwise specified. amb Symbol Parameter V forward voltage F I reverse current ...
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... NXP Semiconductors Table 6. Characteristics …continued unless otherwise specified. amb Symbol Parameter L insertion loss ins L insertion loss ins insertion loss L ins L insertion loss ins charge carrier life time L L series inductance S 500 C d (fF) 400 300 200 100 MHz Fig 1. Diode capacitance as a function of reverse voltage ...
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... NXP Semiconductors 0 ISL (dB 500 1000 1500 2000 amb Diode zero biased and inserted in series with a 50 stripline circuit Fig 3. Isolation of the diode as a function of frequency; typical values BAP64LX_1 Product data sheet 001aag639 0 L ins (dB) (1) (2) 0.5 (3) 1.0 (4) 1.5 2.0 2.5 2500 ...
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... NXP Semiconductors 8. Package outline Leadless ultra small plastic package; 2 terminals; body 1 x 0 (1) DIMENSIONS (mm are the original dimensions UNIT max 0.40 0.55 0.65 mm 0.04 0.36 0.45 0.55 Note 1. The marking bar indicates the cathode OUTLINE VERSION IEC SOD882T Fig 5. Package outline SOD882T ...
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... NXP Semiconductors 9. Abbreviations Table 7. Acronym PIN SMD RF 10. Revision history Table 8. Revision history Document ID Release date BAP64LX_1 20070629 BAP64LX_1 Product data sheet Abbreviations Description P-type, Intrinsic, N-type Surface Mounted Device Radio Frequency Data sheet status Product data sheet Rev. 01 — 29 June 2007 ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Legal information 11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7 11.2 Defi ...