BAP51-03 NXP Semiconductors, BAP51-03 Datasheet - Page 5

General purpose PIN diode in a SOD323 small plastic SMD package

BAP51-03

Manufacturer Part Number
BAP51-03
Description
General purpose PIN diode in a SOD323 small plastic SMD package
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP51-03

Configuration
Single
Forward Current
50mA
Forward Voltage
1.1V
Power Dissipation
500mW
Operating Temperature Classification
Military
Reverse Voltage
50V
Package Type
SOD-323
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
9@0.5mAOhm
Maximum Series Resistance @ Maximum If
2.5@10mAOhm
Typical Carrier Life Time
550ns
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP51-03
Manufacturer:
NXP
Quantity:
81 000
Part Number:
BAP51-03
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
BAP51-03115
Manufacturer:
NXP Semiconductors
Quantity:
53 223
NXP Semiconductors
PACKAGE OUTLINE
2004 Feb 11
Plastic surface-mounted package; 2 leads
General purpose PIN diode
DIMENSIONS (mm are the original dimensions)
Note
1. The marking bar indicates the cathode
UNIT
mm
VERSION
OUTLINE
SOD323
1.1
0.8
A
max
0.05
A
1
1
0.40
0.25
b
p
IEC
0.25
0.10
(1)
c
1.8
1.6
D
H
D
D
1.35
1.15
JEDEC
E
REFERENCES
0
H
2.7
2.3
D
0.45
0.15
2
L
A
p
0.25
0.15
JEITA
SC-76
Q
scale
b
X
v
p
1
5
M
0.2
v
A
A
2 mm
A
1
detail X
PROJECTION
EUROPEAN
E
L
p
Product specification
BAP51-03
ISSUE DATE
Q
c
03-12-17
06-03-16
SOD323

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