EMIF03-SIM02M8 STMicroelectronics, EMIF03-SIM02M8 Datasheet - Page 7

• Manufacturer Part Number: EMIF03-SIM02M8
• Description: EMI FILTER 3 LINES 8QFN
• Manufacturer: STMicroelectronics
• Series: IPAD™r

Specifications of EMIF03-SIM02M8

• Filter Type: Signal Line
• Voltage - Rated: 3V
• Mounting Type: Surface Mount
• Termination Style: Surface Mount (SMD,SMT)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Inductance: -
• Other names: Q4654559

EMIF03-SIM02M8
5
5.1
5.2
Recommendation on PCB assembly
Stencil opening design
1.
Figure 16. Stencil opening dimensions
2.
Solder paste
1.
2.
3.
4.
General recommendation on stencil opening design
a)
b)
Reference design
a)
b)
c)
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste is recommended.
Offers a high tack force to resist component movement during high speed
Solder paste with fine particles: powder particle size is 20-45 µm.
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
General Design Rule
Stencil thickness (T) = 75 ~ 125 µm
Stencil opening thickness: 100 µm
Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
Example: Stencil opening L = 680 µm, W = 300 µm
Footprint (see
Stencil opening for leads: Opening to footprint ratio is 90%.
Example: Stencil opening L = 570 µm, W = 190 µm
Footprint (see
Aspect Ratio
Aspect Area
Figure
Figure
=
=
W
---- -
--------------------------- -
2T L
T
13) L = 1000 µm, W = 400 µm
13) L = 600 µm, W = 200 µm
L
≥
(
×
1.5
+
W
W
)
≥
L
0.66
T
W
Recommendation on PCB assembly
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