SI5364-H-GL Silicon Laboratories Inc, SI5364-H-GL Datasheet - Page 36

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SI5364-H-GL

Manufacturer Part Number
SI5364-H-GL
Description
IC CLOCK SONET/SDH PORT 99LFBGA
Manufacturer
Silicon Laboratories Inc
Datasheet

Specifications of SI5364-H-GL

Input
*
Output
*
Frequency - Max
*
Voltage - Supply
*
Operating Temperature
*
Mounting Type
Surface Mount
Package / Case
99-LFBGA
Frequency-max
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI5364-H-GL
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Company:
Part Number:
SI5364-H-GL
Quantity:
168
Company:
Part Number:
SI5364-H-GL
Quantity:
168
Si5364
6. 11x11 mm PBGA Card Layout
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
36
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
be 60 µm minimum, all the way around the pad.
paste release.
Symbol
C1
C2
E1
E2
X
0.40
Min
Rev. 2.5
Nom
0.45
9.00
9.00
1.00
1.00
Max
0.50

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